Integrated cooling assembly with upper and lower channels

Abstract

Embodiments herein provide for fluidic cooling assemblies embedded within a device package and related manufacturing methods. In one embodiment, an integrated cooling assembly includes a semiconductor device and a cold plate attached to a backside of the semiconductor device. The cold plate includes an upper portion disposed vertically adjacent to the backside of the semiconductor device and a lower portion disposed between the upper portion of the cold plate and the backside of the semiconductor device. The upper portion includes upper coolant channels defined by upper cavity sidewalls. The lower portion includes lower coolant channels defined by lower cavity sidewalls. The upper cavity sidewalls extend downwardly into regions between adjacent lower coolant channels. The lower cavity sidewalls extend upwardly into regions between adjacent upper coolant channels.

Dependencies are inferred from the claim text.