Integrated multi-chip module having a conformal chip/heat exchanger interface

A module having a plurality of semiconductor chips comprising:

• a substrate having opposed first and second major sides,
• a plurality of electrical components mounted to at least said first major side,
• a first heat exchanger means at said first major side for conducting thermal energy generated by said components, said first heat exchanger means providing a first heat flow path from said components,
• a second heat exchanger means at said second major side for conducting thermal energy generated by said components,
• said first heat exchange comprising:
• a heat sink,
• a thin thermally conductive membrane attached to said heat sink and positioned to contact said electrical components, said membrane combining with said heat sink to form a fluid-tight chamber, and
• a substantially static thermally conductive liquid sealed within said fluid-tight chamber to provide a conformal material for bending said membrane with variations in height and skew of said electrical components relative to said substrate.

A multi-chip module comprising:

• a heat sink having a high thermal conductivity and having a liquid-containment cavity,
• a substrate having a plurality of integrated circuit chips electrically connected on a first side of said substrate, said substrate coupled to said heat sink for housing said chips, said chips each having opposing first and second major surfaces, each first major surface facing said first side of said substrate, each second major surface facing away from said first side of said substrate, and
• compensating means for providing a conformal thermal energy path from said chips to said heat sink, said compensating means having a high thermal conductivity, said compensating means comprising:
• a liquid-backed member positioned to be in heat transfer relationship with each of said chips when said second major surfaces of said chips are coplanar, said liquid-backed member having a high electrical conductivity and extending substantially parallel to said substrate, and
• a substantially static liquid entrapped between said heat sink and said liquid-backed member to pressure said liquid-backed member to conform to said chips when said second major surfaces are non-coplanar, said static liquid being in a generally non-flow condition within said liquid-containment cavity of said heat sink, said second major surfaces of said chips being electrically grounded via said liquid backed member and said heat sink.