Two-sided liquid cooling
AssigneeAdeia Semiconductor Bonding Technologies Inc.
InventorsRasit Onur Topaloglu, Belgacem Haba
Life of this patent
Estimating the term…
Abstract
Embodiments herein provide for an integrated cooling assembly and methods of forming the same. The integrated cooling assembly comprises an interposer, a plurality of semiconductor devices, a first cold plate, and at least one second cold plate. The interposer has a first side and a second side opposite the first side. The plurality of semiconductor devices are attached to the first side of the interposer. A first cold plate is attached to at least one of the plurality of first semiconductor devices. At least one second cold plate is attached to the second side of the interposer.
Claims22
An integrated cooling assembly comprising:
- an interposer having a first side and a second side opposite the first side;
- a plurality of semiconductor devices attached to the first side of the interposer;
- a first cold plate attached to at least one semiconductor device of the plurality of semiconductor devices;
- and
- at least one second cold plate attached to the second side of the interposer,
- wherein each of the first and second cold plates comprises one or more coolant channels.
A method comprising:
- providing an interposer having a first side and a second side opposite the first side, wherein a plurality of semiconductor devices are attached to the first side of the interposer;
- directly bonding a first cold plate to at least one semiconductor device of the plurality of semiconductor devices;
- and
- attaching at least one second cold plate to the second side of the interposer, wherein each of the first and second cold plates comprises one or more coolant channels.
An integrated cooling assembly comprising:
- an interposer having a first side and a second side opposite the first side;
- a plurality of semiconductor devices attached to the first side of the interposer;
- a first cold plate attached to at least one semiconductor device of the plurality of semiconductor devices;
- and
- at least one second cold plate attached to the second side of the interposer, wherein:
- the at least one semiconductor device of the plurality of semiconductor devices comprises one or more pass-through power TSVs;
- and
- the first cold plate comprises one or more electrical connections.
Dependencies are inferred from the claim text.