Dimensionally stable semiconductor device

A semiconductor device, comprising:

• a base board,
• a semiconductor chip having two main faces and mounted onto said base board at one of said two main faces,
• a metallic plate of good thermal conductivity mounted onto said semiconductor chip at the other of said two main faces,
• a heat dissipating and enclosing member mounted onto said base board for hermetically enclosing said semiconductor chip and having a portion facing said metallic plate mounted onto said other main face of said semiconductor chip with a gap therebetween for dissipating heat of said semiconductor chip,
• a first adhesive material interposed between said metallic plate and said other main face of said semiconductor chip for mounting said metallic plate onto said other main face of said semiconductor chip, and
• a second adhesive material interposed between said heat dissipating and enclosing member and said base board for hermetically mounting said heat dissipating and enclosing member onto said base board,
• said first adhesive material being selected to have a melting point lower than that of said second adhesive material, mounting of said metallic plate onto said other main face of said semiconductor chip with said first adhesive material and mounting of said heat dissipating and mounting member onto said base board with said second adhesive material being carried out by simultaneous heating of said first and second adhesive materials to said melting points thereof, said gap between said metallic plate and said portion of said heat dissipating and enclosing member facing said metallic plate being formed and dimensionally controlled as a result of earlier soldification of said second adhesive material in relation to said first adhesive material.