H10W 40/235
Attached to package parts
Official title: {attached to package parts}
H10W40/235 (Attached to package parts) appears on 501 US grants and 593 published applications in this corpus.
Search patents in H10W- Granted patents
- 501
- Published applications
- 593
- Assignees
- 274
- Inventors
- 1,269
- Latest grant
- 22 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 4 | 0 |
| 1977 | 3 | 0 |
| 1978 | 6 | 0 |
| 1979 | 4 | 0 |
| 1980 | 2 | 0 |
| 1981 | 3 | 0 |
| 1982 | 4 | 0 |
| 1983 | 4 | 0 |
| 1984 | 5 | 0 |
| 1985 | 2 | 0 |
| 1986 | 10 | 0 |
| 1987 | 12 | 0 |
| 1988 | 6 | 0 |
| 1989 | 7 | 0 |
| 1990 | 2 | 0 |
| 1991 | 10 | 0 |
| 1992 | 2 | 0 |
| 1993 | 9 | 0 |
| 1994 | 10 | 0 |
| 1995 | 5 | 0 |
| 1996 | 5 | 0 |
| 1997 | 6 | 0 |
| 1998 | 10 | 0 |
| 1999 | 6 | 0 |
| 2000 | 7 | 0 |
| 2001 | 5 | 1 |
| 2002 | 3 | 3 |
| 2003 | 3 | 2 |
| 2004 | 4 | 8 |
| 2005 | 3 | 11 |
| 2006 | 12 | 26 |
| 2007 | 12 | 19 |
| 2008 | 19 | 23 |
| 2009 | 27 | 23 |
| 2010 | 21 | 19 |
| 2011 | 10 | 3 |
| 2012 | 7 | 2 |
| 2013 | 2 | 3 |
| 2014 | 1 | 10 |
| 2015 | 7 | 13 |
| 2016 | 11 | 6 |
| 2017 | 4 | 9 |
| 2018 | 11 | 15 |
| 2019 | 13 | 31 |
| 2020 | 25 | 25 |
| 2021 | 24 | 24 |
| 2022 | 26 | 25 |
| 2023 | 17 | 31 |
| 2024 | 25 | 69 |
| 2025 | 43 | 22 |
| 2026 | 22 | 170 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Systems and methods for an interlocking feature on a power module22 Sep 2026US 12,745,368 B2BorgWarner US Technologies LLC
- Systems and methods for active discharge for inverter for electric vehicle22 Sep 2026US 12,745,369 B2BorgWarner US Technologies LLC
- Display device and method for manufacturing the same25 Aug 2026US 12,721,172 B2Samsung Display Co., Ltd.
- Semiconductor package structure18 Aug 2026US 12,713,919 B2Advanced Semiconductor Engineering, Inc.
- Apparatus for enclosing a power unit and for centring a control unit with respect to the power unit14 Jul 2026US 12,684,742 B2Siemens Aktiengesellschaft
- Electronic device including insulation plate cover and grounding piece8 Oct 2026US 2026/0314401 A1LG Innotek Co., Ltd.
- Electronic component and apparatus8 Oct 2026US 2026/0314402 A1
- Semiconductor package8 Oct 2026US 2026/0314404 A1Samsung Electronics Co., Ltd.
- Semiconductor device and method of manufacturing semiconductor device8 Oct 2026US 2026/0314437 A1Mitsubishi Electric Corporation
- Semiconductor device and vehicle8 Oct 2026US 2026/0314464 A1Fuji Electric Co., Ltd.
Most cited
By later US patents
- Land grid array package/circuit board assemblies and methods for constructing the same133US 5,473,510 AConvex Computer Corporation · 1995
- Fluid cooling systems for electronic systems132US 4,109,707 AHoneywell Information Systems Inc. · 1978
- Dual-sided heat removal system101US 6,580,611 B1Intel Corporation · 2003
- Staggered radial-fin heat sink device for integrated circuit package100US 4,715,438 AUnisys Corporation · 1987
- Heat sink assembly for solid state devices100US 5,397,919 ASquare Head Inc. · 1995