Dual-sided heat removal system
AssigneeIntel Corporation
InventorsGilroy J. Vandentop, Raj Nair, Chia-Pin Chiu, Yuan-Liang Li
Life of this patent
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Abstract
The present invention describes a method and apparatus for mounting a microelectronic device parallel to a substrate with an interposer and two heat sinks, one on each side of the substrate.
Claims31
In an assembly with a microprocessor mounted parallel to a printed circuit board (PCB) a dual-sided heat removal apparatus, comprising:
- an interposer electrically coupled to both the microprocessor and the PCB for passing electrical signals between the microprocessor and the PCB;
- a first heat sink thermally coupled to the microprocessor and extending through an opening in the PCB for dissipating heat;
- and
- a second heat sink thermally coupled to said interposer for dissipating heat.
In an assembly with a microprocessor mounted parallel to a printed circuit board (PCB), a dual sided heat removal apparatus, comprising:
- an interposer electrically coupled to both the microprocessor and the PCB for passing electrical signals between the microprocessor and the PCB;
- a first heat sink thermally coupled to said interposer and extending through an opening in the PCB for dissipating heat;
- and
- a second heat sink thermally coupled to the microprocessor for dissipating heat.
An apparatus for dissipating heat from a-microprocessor mounted on a printed circuit board (PCB), comprising:
- a first heat sink thermally coupled to the microprocessor, on the PCB side of the microprocessor, for dissipating heat from the microprocessor;
- and
- wherein said first heat sink extends through an opening in the PCB.
An apparatus for dissipating heat from a microprocessor connected to a printed circuit board (PCB) through an interposer, comprising:
- a first heat sink directly coupled, mechanically and thermally, to an interposer, on the PCB side of said interposer.
A method of cooling a microprocessor, comprising:
- electrically connecting the microprocessor to a PCB with an interposer;
- mounting the microprocessor and said interposer over an opening in said PCB;
- thermally connecting the microprocessor and said interposer to a pair of heat sinks;
- and
- wherein one of said pair of heat sinks extends through an opening in the PCB.
A method of cooling a microprocessor, comprising:
- dissipating heat from the microprocessor-interposer unit through a pair of heat sinks located on opposite sides of plane defined by the PCB;
- and
- connecting first of said pair of heat sinks directly to the microprocessor-interposer unit through an opening in the PCB.
Dependencies are inferred from the claim text.