Heat sink assembly for solid state devices
AssigneeSquare Head Inc.
InventorsPeter D. Tata, William B. Rife
Life of this patent
Estimating the term…
Abstract
A heat sink assembly adapted for use with an electronic device package such as a microprocessor having a grid array is shown having, in a first embodiment, a threaded base of a finned heat sink adapted to be received in a threaded bore of an adaptor which mounts onto the electronic device package. Desired thermal coupling is achieved by screwing down the heat sink in biasing engagement with the package. Alternate embodiments show the heat sink which has a snap on flange to attach the heat sink to the adaptor and the adaptor extending down to engage with the socket in which the microprocessor is installed.
Claims24
A heat sink assembly for removing heat from an electronic device package installed in a socket on a circuit board comprising
- an adaptor having a top wall and having a pair of opposed side walls depending downwardly therefrom, a groove formed in each side wall extending generally parallel to the top wall in alignment with and facing each other and being capable of slidably receiving said electronic device package and said socket simultaneously, said groove formed in each side wall having a width slightly greater than the combined thickness of said electronic device package and said socket, first and second planes lying respectively in the top and bottom of the grooves defining a space therebetween, the groove being adapted to clampingly receive opposite marginal portions of a socket carrying a electronic device package when inserted therein, a bore centrally located in the top wall and extending therethrough,
- a heat sink member having a cylindrical base member with a flat bottom surface adapted to be received through the bore in the top wall, the base member formed with means to engage with the periphery of the bore to secure and to attach the heat sink member to the adaptor with the flat bottom surface disposed in the space between the first and second planes whereby an electronic device package installed in a socket slidably inserted in the grooves will cause the top wall to bow through engagement with the flat bottom surface of the base.
A heat sink assembly for removing heat from an electronic device package having an outer peripheral edge and an array of pins installed in a socket capable of receiving said pins on a circuit board comprising
- an adaptor having a top wall and having a pair of opposed side walls depending therefrom, each side wall having a distal end portion and having an inwardly laterally extending lip, forming a groove adapted to receive between each lip and the top wall the marginal portions of a socket and electronic device package arrangement inserted therein, said groove formed in each side wall having a width slightly greater than the combined thickness of said electronic device package and said socket, a threaded bore formed through the top wall, said socket and electronic device package arrangement including an electronic device package installed into said socket;
- each of said lips extending inward a distance less than the distance from the outer edge of said electronic device package to said pins;
- and
- a heat sink member having a threaded base portion with a substantially flat bottom surface adapted to be threadably received in the threaded bore in the top wall whereby the base of the heat sink can be screwed down through the bore in the top wall with a flat bottom surface in engagement with a top surface of the electronic device package installed in the socket and received in the adaptor.
A heat sink assembly for removing heat from an electronic device package installed in a socket on a circuit board comprising
- an adaptor having a top wall and having a pair of opposed side walls depending downwardly therefrom to a lower distal end portion, a lip extending laterally inwardly from each lower distal end portion aligned with and facing each other, an aperture formed in the top wall extending therethrough, said adaptor having a receiving aperture with a width slightly greater than the combined thickness of said electronic device package and said socket, said adaptor being capable of slidably receiving the electronic device package and said socket simultaneously;
- a heat sink member having a base member with a flat bottom surface adapted to be received through the aperture in the top wall, the base member formed with means to directly engage the periphery of the aperture to secure and to attach the heat sink member to the adaptor with the flat bottom surface disposed below the top wall whereby an electronic device package and socket held between the side walls above the lips will be disposed in heat transfer relation with the heat sink member.
A heat sink assembly for removing heat from an electronic device package installed in a socket on a circuit board comprising
- an adaptor having a top wall and having a pair of spaced side walls depending downwardly therefrom to a lower distal end portion, a lip extending laterally inwardly from each lower distal end portion, an aperture formed in the top wall extending therethrough,
- a heat sink member having a base member with a flat bottom surface adapted to be received through the aperture in the top wall, the base member formed with means to attach the heat sink member to the adaptor with the flat bottom surface disposed below the top wall whereby an electronic device package and socket held between the side walls above the lips will be disposed in heat transfer relation with the heat sink member.
A heat sink assembly for removing heat from an electronic device package installed in a socket on a circuit board comprising
- an adaptor having a top wall and having a pair of opposed side walls depending downwardly therefrom, a groove formed in each side wall extending generally parallel to the top wall in alignment with and facing each other, said groove formed in each side wall having a width slightly greater than the combined thickness of said electronic device package and said socket, and being capable of slidably receiving said electronic device package and said socket simultaneously, first and second planes lying respectively in the top and bottom of the grooves defining a space therebetween,
- means for securing said adaptor on the electronic package,
- a bore centrally located in the top wall and extending therethrough,
- a heat sink member having a cylindrical base member with a flat bottom surface adapted to be received through the bore in the top wall, the base member formed with means to engage with the periphery of the bore to secure and to attach the heat sink member to the adaptor with the flat bottom surface disposed in the space between the first and second planes whereby an electronic device package installed in a socket slidably inserted in the grooves will cause the top wall to bow through engagement with the flat bottom surface of the base.
Dependencies are inferred from the claim text.