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US 12,713,919 B2Granted
Semiconductor package structure
AssigneeAdvanced Semiconductor Engineering, Inc.
InventorsHung-Hsien Huang, Wen Chun Wu, Chih-Pin Hung
Life of this patent
Estimating the term…
Abstract
A semiconductor device package and a method of manufacturing a semiconductor device package are provided. The semiconductor device package includes at least one electronic component, a heat source, and a heat dissipation element. The heat source is adjacent to the electronic component. The heat dissipation element is disposed adjacent to the heat source and the electronic component. The heat dissipation element includes a heat transmitting structure configured to reduce heat, which is from the heat source, through the heat dissipation element, and transmitting in a direction toward the electronic component.
Claims20
A semiconductor package structure, comprising:
- at least one electronic component;
- a heat source adjacent to the electronic component;
- and
- a heat dissipation element disposed adjacent to the heat source and the electronic component, the heat dissipation element comprising a heat transmitting structure configured to reduce heat which is from the heat source, through the heat dissipation element, and transmitting in a direction toward the electronic component, wherein the heat transmitting structure comprises:
- a plurality of protrusions;
- one or more dendritic structures disposed on surfaces of the plurality of protrusions, wherein the one or more dendritic structures comprise:
- a plurality of trunks;
- a plurality of first branches grown from the trunks;
- and
- a plurality of second branches grown from the first branches, wherein the plurality of first branches and the plurality of second branches extend toward at least two different directions, wherein interfaces exist between the one or more dendritic structures and inner surfaces and bottom surfaces of the plurality of protrusions, and
- wherein the heat transmitting structure is located over the heat source, and the heat transmitting structure is configured to dissipate heat upwards faster than in lateral directions.
8 more elements
A semiconductor package structure, comprising:
- a heat source;
- a heat dissipation element attached to the heat source, wherein the heat dissipation element comprises a heat transmitting portion and a heat dissipating portion, and the heat transmitting portion is configured to reduce a first expansion of the heat dissipating portion caused by the heat dissipating portion absorbing heat generated by the heat source, wherein the heat transmitting portion comprises:
- a plurality of protrusions;
- one or more dendritic structures disposed on surfaces of the plurality of protrusions, wherein the one or more dendritic structures comprise:
- a plurality of trunks;
- a plurality of first branches grown from the trunks;
- and
- a plurality of second branches grown from the first branches, wherein the plurality of first branches and the plurality of second branches extend toward at least two different directions, wherein interfaces exist between the one or more dendritic structures and inner surfaces and bottom surfaces of the plurality of protrusions;
- and
- a heat sink disposed over the heat dissipation element,
- wherein the heat transmitting portion is located over the heat source, and the heat transmitting portion is configured to dissipate heat in a direction from the heat source toward the heat sink.
8 more elements
A semiconductor package structure, comprising:
- a first electronic component;
- a heat source adjacent to the first electronic component;
- a heat dissipation element disposed over the first electronic component and the heat source, wherein the heat dissipation element comprises a heat transmitting structure over the heat source, and the heat transmitting structure is free from overlapping the first electronic component from a top view perspective, wherein the heat transmitting structure comprises:
- a plurality of protrusions;
- one or more dendritic structures disposed on surfaces of the plurality of protrusions, wherein the one or more dendritic structures comprise:
- a plurality of trunks;
- a plurality of first branches grown from the trunks;
- and
- a plurality of second branches grown from the first branches, wherein the plurality of first branches and the plurality of second branches extend toward at least two different directions, wherein interfaces exist between the one or more dendritic structures and inner surfaces and bottom surfaces of the plurality of protrusions;
- and
- a substrate, to which the heat source is attached,
- wherein the heat transmitting structure is located over the heat source, and the heat transmitting structure is configured to dissipate heat in a direction perpendicular to an upper surface of the substrate.
9 more elements
Dependencies are inferred from the claim text.