H10W 40/237
Attached to additional arrangements for cooling
Official title: {attached to additional arrangements for cooling}
H10W40/237 (Attached to additional arrangements for cooling) appears on 179 US grants and 204 published applications in this corpus.
Search patents in H10W- Granted patents
- 179
- Published applications
- 204
- Assignees
- 133
- Inventors
- 518
- Latest grant
- 26 May 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 2 | 0 |
| 1978 | 1 | 0 |
| 1979 | 1 | 0 |
| 1980 | 1 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 2 | 0 |
| 1986 | 0 | 0 |
| 1987 | 1 | 0 |
| 1988 | 3 | 0 |
| 1989 | 2 | 0 |
| 1990 | 0 | 0 |
| 1991 | 1 | 0 |
| 1992 | 2 | 0 |
| 1993 | 1 | 0 |
| 1994 | 2 | 0 |
| 1995 | 0 | 0 |
| 1996 | 3 | 0 |
| 1997 | 4 | 0 |
| 1998 | 6 | 0 |
| 1999 | 2 | 0 |
| 2000 | 2 | 0 |
| 2001 | 2 | 1 |
| 2002 | 4 | 3 |
| 2003 | 4 | 0 |
| 2004 | 1 | 3 |
| 2005 | 1 | 3 |
| 2006 | 0 | 8 |
| 2007 | 5 | 8 |
| 2008 | 11 | 16 |
| 2009 | 8 | 12 |
| 2010 | 8 | 12 |
| 2011 | 8 | 8 |
| 2012 | 4 | 5 |
| 2013 | 2 | 6 |
| 2014 | 6 | 13 |
| 2015 | 7 | 9 |
| 2016 | 6 | 11 |
| 2017 | 9 | 9 |
| 2018 | 10 | 11 |
| 2019 | 8 | 8 |
| 2020 | 8 | 10 |
| 2021 | 10 | 9 |
| 2022 | 5 | 0 |
| 2023 | 6 | 15 |
| 2024 | 1 | 3 |
| 2025 | 4 | 3 |
| 2026 | 3 | 18 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Chip package with decoupled thermal management26 May 2026US 12,642,092 B2Xilinx, Inc.
- Heatsink for a memory and routing module24 Mar 2026US 12,588,501 B2Graphcore Limited
- Cooling package structure applied to integrated circuit3 Feb 2026US 12,543,570 B2NVIDIA Corporation
- Lid allowing for a thermal interface material with fluidity in a lidded flip chip package9 Sep 2025US 12,412,803 B2
- Heat dissipation device1 Jul 2025US 12,347,746 B2Auras Technology Co., Ltd.
- Semiconductor device1 Oct 2026US 2026/0305334 A1Fuji Electric Co., Ltd.
- Power semiconductor module and method of manufacturing the same1 Oct 2026US 2026/0305335 A1Infineon Technologies AG
- Structures and processes for attaching cold plates to multi chip modules1 Oct 2026US 2026/0305336 A1
- Power electronics component with cooling and a power converter17 Sep 2026US 2026/0282903 A1Trumpf HüTtinger GmbH + Co. KG
- Eight-axis six-head linkage laser engraving machine with cooling circulation structure27 Aug 2026US 2026/0249400 A1Dongguan Di Ao Cnc Equipment Co.,Ltd
Most cited
By later US patents
- Dual-sided heat removal system101US 6,580,611 B1Intel Corporation · 2003
- Integrated multi-chip module having a conformal chip/heat exchanger interface98US 5,323,292 AHewlett-Packard Company · 1994
- Mechanically floating multi-chip substrate79US 5,608,610 AHewlett-Packard Company · 1997
- Direct chip connection using demountable flip chip package77US 5,528,462 A1996
- Cooling assembly for cooling electrical parts wherein a heat pipe is attached to a heat conducting portion of a heat conductive block71US 4,204,246 ASony Corporation · 1980