Cooling package structure applied to integrated circuit

An integrated circuit cooling package, comprising:

• a package substrate having a first package surface and a second package surface on an opposite side as the first package surface;
• a first enclosure mounted to the first package surface, the first enclosure sized to surround a circuit die therein, wherein, a first die surface of the circuit die is coupled to the first package surface by a solder ball grid array such that a first gap is present between the first die surface of the circuit die and the first package surface, and a second gap is present between interior sidewalls of the first enclosure and sidewall surfaces of the circuit die;
• a first thermal conductive material located in the first gap and in the second gap such that the thermal conductive material contacts the first package surface of the package substrate, the inner sidewalls of the first enclosure and the first die surface and the sidewall surfaces of the circuit die;
• a second enclosure mounted to the second package surface, wherein the second enclosure is aligned with the first enclosure;
• and
• a second thermal conductive material located in a third gap of the second enclosure and contacting the second package surface.