Power electronics component with cooling and a power converter

A power electronics component for an electric power converter for an industrial process assembly designed to supply a load, the component comprising:

• an electrically insulating substrate comprising a top-side metallization layer on a top side and a bottom-side metallization layer on a bottom side, wherein the top-side metallization layer is divided into at least three electrically isolated regions of a conductor structure;
• a semiconductor assembly mounted on the substrate, comprising:
• at least two semiconductor components connected in series, at least one of which is a controllable power semiconductor component, wherein the two semiconductor components connected in series each comprise:
• at least one first connection configured as a collector connection surface or source connection surface, thermally and electrically connected to at least one first region of the conductor structure, and
• at least one second connection configured as an emitter connection surface or drain connection surface, electrically connected via a plurality of connecting lines to a second connection surface of another semiconductor component and/or to one of the regions of the conductor structure;
• and
• a heat sink arranged on the substrate, wherein a first side facing the substrate is thermally connected to the bottom-side metallization layer of the substrate, which bottom-side metallization layer faces away from the semiconductor assembly,
• wherein the heat sink is monolithically constructed, is fixedly connected to the bottom-side metallization layer, and comprises a cooling channel for guiding a cooling flow.