Heatsink for a memory and routing module

A heatsink for a memory and routing module, the memory and routing module having a lower side and an upper side, the lower side having a first plurality of semiconductor chips attached thereto and the upper side having a second plurality of semiconductor chips attached thereto, the lower side further having a first connection component disposed thereon, the memory and routing module configured for electrical connection to a motherboard, the heatsink comprising:

• a lower heatsink component comprising:
• a module receiving region configured to receive the lower side of the memory and routing module and comprising:
• a first thermally conductive portion arranged to face the first plurality of semiconductor chips;
• a first aperture through the lower heatsink component configured to permit the first connection component disposed on the lower side of the memory and routing module to connect to a corresponding second connection component disposed on the motherboard;
• a thermally conductive peripheral region disposed around the module receiving region, the peripheral region connected to the first thermally conductive portion and comprising a plurality of first heat dissipating elements configured to dissipate heat conducted from the first plurality of semiconductor chips;
• an upper heatsink component, the upper heatsink component configured to connect to the lower heatsink component at the peripheral region so as to retain the memory and routing module between the upper heatsink component and the lower heatsink component, the upper heatsink component comprising:
• a first side comprising a second thermally conductive portion arranged to face the second plurality of semiconductor chips;
• a plurality of second heat dissipating elements connected to the second thermally conductive portion and configured to dissipate heat conducted from the first plurality of semiconductor chips.