Heat dissipation device
AssigneeAuras Technology Co., Ltd.
InventorsCheng-Ju Chang, Wan-Hsuan Lin, Chung-Chien Su
Life of this patent
Estimating the term…
Abstract
A heat dissipation device includes a main fixed base plate, a main heat pipe set, a lower heat dissipation fin set and an upper heat dissipation module. The main heat pipe set is fixed on the main fixed base plate, and the lower heat dissipation fin set is also fixed on the main fixed base plate, and the main heat pipe set passes through the lower heat dissipation fin set, and is exposed on the lower heat dissipation fin set. In addition, the upper heat dissipation module is detachably installed on the lower heat dissipation fin set and contacts the main heat pipe set.
Claims9
A heat dissipation device, comprising:
- a main fixed base plate;
- a main heat pipe set fixed on the main fixed base plate;
- a lower heat dissipation fin set fixed on the main fixed base plate, and the main heat pipe set passing through the lower heat dissipation fin set and exposed on the lower heat dissipation fin set;
- an upper heat dissipation module detachably installed on the lower heat dissipation fin set and contacting the main heat pipe set;
- an upper main heat dissipation fin set;
- at least one auxiliary heat dissipation fin set disposed on a side of the upper main heat dissipation fin set;
- a first auxiliary heat dissipation fin set and a second auxiliary heat dissipation fin set respectively disposed on two sides of the upper main heat dissipation fin set, and a thickness of the upper main heat dissipation fin set is less than or equal to a thickness of the first auxiliary heat dissipation fin set and a thickness of the second auxiliary heat dissipation fin set;
- and
- an upper heat pipe set passing through the first auxiliary heat dissipation fin set, the upper main heat dissipation fin set and the second auxiliary heat dissipation fin set.
Dependencies are inferred from the claim text.