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US 12,720,666 B2Granted
Electronic device including a substrate with an electronic component and a heat emitting body disposed on respective surfaces of the substrate
AssigneeLG Innotek Co., Ltd.
InventorsYong Seok Cho, Won Seok Nam, Jae Sam Lee, Yun Young Jung
Life of this patent
Estimating the term…
Abstract
This electronic device comprises: a substrate including a hole; an electronic component disposed on one surface of the substrate; a heat emitting body disposed on the other surface of the substrate; and a heat transfer member disposed between the electronic component and the heat emitting body, wherein the hole includes a first region into which a portion of the heat transfer member is inserted and a second region having a smaller width than the first region.
Claims16
An electronic device comprising:
- a substrate including a hole;
- an electronic component disposed on one surface of the substrate;
- a heat emitting body disposed on an other surface of the substrate;
- and
- a heat transfer member disposed between the electronic component and the heat emitting body,
- wherein the hole includes a first region into which a portion of the heat transfer member is inserted and a second region having a smaller width than does the first region,
- wherein when an arrangement direction of the first region and the second region is referred to as a first direction, a length of the portion of the heat transfer member is longer than a length of the second region with respect to a second direction perpendicular to the first direction,
- wherein the substrate includes a circuit pattern electrically connected to the electronic component, and
- wherein when the length of the second region in the first direction is L1 and the separation distance between the second region and the circuit pattern with respect to the first direction is L2, L1:L2=2:1 is satisfied.
6 more elements
An electronic device comprising:
- a substrate including a hole;
- an electronic component disposed on one surface of the substrate;
- a heat emitting body disposed on an other surface of the substrate;
- and
- a heat transfer member disposed between the electronic component and the heat emitting body,
- wherein the hole includes a first region into which a portion of the heat transfer member is inserted and a second region having a smaller width than does the first region,
- wherein the heat transfer member includes:
- a body portion having a length greater than a length of the hole with respect to a first direction;
- and
- a protruded portion extended from the body portion to be disposed in the hole of the substrate and connected to the electronic component,
- wherein the body portion is soldered to the substrate, and
- wherein the electronic component is soldered to a surface of the protruded portion.
9 more elements
An electronic device comprising:
- a substrate including a hole;
- an electronic component disposed on one surface of the substrate;
- a heat emitting body disposed on an other surface of the substrate;
- and
- a heat transfer member disposed between the electronic component and the heat emitting body,
- wherein the hole includes a first region into which a portion of the heat transfer member is inserted and a second region having a smaller width than does the first region,
- wherein the heat transfer member includes:
- a body portion having a length greater than a length of the hole with respect to a first direction;
- and
- a protruded portion extended from the body portion to be disposed in the hole of the substrate and connected to the electronic component, and
- wherein a pad to which the body portion is soldered is disposed on a surface of the substrate.
8 more elements
An electronic device comprising:
- a substrate including a hole;
- an electronic component disposed on one side of the substrate;
- a heat emitting body disposed on an other surface of the substrate;
- and
- a heat transfer member disposed between the electronic component and the heat emitting body,
- wherein the hole includes a first region into which a portion of the heat transfer member is inserted and a second region having a smaller width than does the first region,
- wherein the heat transfer member penetrates the substrate,
- wherein one side surface of the heat transfer member is spaced apart from one side surface of the hole of the substrate in a first direction,
- wherein the heat transfer member includes:
- a body portion having a length greater than a length of the hole with respect to a first direction;
- and
- a protruded portion extended from the body portion to be disposed in the hole of the substrate and connected to the electronic component,
- wherein a first distance from one end of the protruded portion to one end of the body portion is greater than a second distance from an other end of the protruded portion to an other end of the body portion, and
- wherein an area of the body portion having the second distance overlaps the second region of the hole.
11 more elements
Dependencies are inferred from the claim text.