H10W 40/242
Comprising thermal conductors between chips and the and the arrangements for cooling
Official title: {comprising thermal conductors between chips and the and the arrangements for cooling, e.g. compliant heat-spreaders}
H10W40/242 (Comprising thermal conductors between chips and the and the arrangements for cooling) appears on 198 US grants and 363 published applications in this corpus.
Search patents in H10W- Granted patents
- 198
- Published applications
- 363
- Assignees
- 180
- Inventors
- 783
- Latest grant
- 25 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1979 | 1 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 2 | 0 |
| 1986 | 1 | 0 |
| 1987 | 3 | 0 |
| 1988 | 1 | 0 |
| 1989 | 1 | 0 |
| 1990 | 0 | 0 |
| 1991 | 3 | 0 |
| 1992 | 2 | 0 |
| 1993 | 4 | 0 |
| 1994 | 2 | 0 |
| 1995 | 2 | 0 |
| 1996 | 4 | 0 |
| 1997 | 4 | 0 |
| 1998 | 6 | 0 |
| 1999 | 7 | 0 |
| 2000 | 3 | 0 |
| 2001 | 0 | 0 |
| 2002 | 3 | 4 |
| 2003 | 2 | 0 |
| 2004 | 2 | 2 |
| 2005 | 1 | 2 |
| 2006 | 1 | 2 |
| 2007 | 1 | 2 |
| 2008 | 2 | 3 |
| 2009 | 2 | 2 |
| 2010 | 3 | 3 |
| 2011 | 0 | 0 |
| 2012 | 0 | 2 |
| 2013 | 2 | 4 |
| 2014 | 3 | 3 |
| 2015 | 2 | 7 |
| 2016 | 5 | 12 |
| 2017 | 11 | 14 |
| 2018 | 14 | 13 |
| 2019 | 18 | 14 |
| 2020 | 16 | 21 |
| 2021 | 14 | 14 |
| 2022 | 10 | 9 |
| 2023 | 12 | 24 |
| 2024 | 8 | 15 |
| 2025 | 10 | 9 |
| 2026 | 10 | 182 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Electronic device including a substrate with an electronic component and a heat emitting body disposed on respective surfaces of the substrate25 Aug 2026US 12,720,666 B2LG Innotek Co., Ltd.
- Electronic package module25 Aug 2026US 12,721,169 B2Acer Incorporated
- Reinforcement structure and electronic device18 Aug 2026US 12,713,927 B2Huawei Technologies Co., Ltd.
- Semiconductor device4 Aug 2026US 12,701,683 B2Hitachi Astemo, Ltd.
- Power block based on top-side cool surface-mount discrete devices with double-sided heat sinking9 Jun 2026US 12,653,029 B2United Silicon Carbide, Inc.
- Creating a sintering metallization layer on exposed surfaces of silicon dies for dsmbgas to enhance heat dissipation8 Oct 2026US 2026/0314403 A1Qorvo US, Inc.
- Semiconductor package8 Oct 2026US 2026/0314404 A1Samsung Electronics Co., Ltd.
- A thermal interface material, an integrated circuit formed therewith, and a method of application thereof8 Oct 2026US 2026/0314406 A1Arieca Inc.
- Thermally conductive silicone composition and production method therefor1 Oct 2026US 2026/0297411 A1Shin-Etsu Chemical Co., Ltd.
- Semiconductor device1 Oct 2026US 2026/0305334 A1Fuji Electric Co., Ltd.
Most cited
By later US patents
- Dimensionally stable semiconductor device102US 4,561,011 AMitsubishi Denki Kabushiki Kaisha · 1985
- Stiffener ring and heat spreader for use with flip chip packaging assemblies97US 5,949,137 ALSI Logic Corporation · 1999
- Electrical assembly96US 4,563,725 AWelwyn Electronics Limited · 1986
- Apparatus for packaging and cooling integrated circuit chips90US 5,184,211 ADigital Equipment Corporation · 1993
- Heat transfer apparatus which accommodates elevational disparity across an upper surface of a surface-mounted semiconductor device90US 5,926,371 AAdvanced Micro Devices, Inc. · 1999