Semiconductor device

An electric circuit body comprising:

• a first semiconductor module and a second semiconductor module in which power semiconductor elements are sealed, respectively;
• a cooling member that cools heat transferred from the power semiconductor elements;
• and
• a fixing member that fixes the cooling member to both surfaces of the first semiconductor module and the second semiconductor module arranged side by side,
• wherein the cooling member fixed to both surfaces of the first semiconductor module and the second semiconductor module and includes a first heat dissipation region that abuts on the first semiconductor module through a heat conduction member, a second heat dissipation region that abuts on the second semiconductor module through the heat conduction member, and a low rigidity portion formed between the first heat dissipation region and the second heat dissipation region to have lower rigidity than the first heat dissipation region and the second heat dissipation region, and
• the fixing member fixes the cooling member to both surfaces of the first semiconductor module and the second semiconductor module in the low rigidity portion of the cooling member.