Stiffener ring and heat spreader for use with flip chip packaging assemblies
AssigneeLSI Logic Corporation
InventorsAshok Domadia, Manickam Thavarajah
Life of this patent
Estimating the term…
Abstract
A stiffener device for use with a flip chip packaging assembly including a generally rectangular, plate-like member having a substantially uniform thickness. At each of the rectangular plate-like member is a curved chamfer portion extending from an upper surface to a lower surface thereof, and defined by a chamfer edge commencing at one side edge forming the respective corner and terminating at an opposite side edge of the respective corner. Each curved chamfer portion is adapted to receptively accommodate a respective mounting bolt therethrough. The fabrication of the stiffener device is formed from a single stamping or punching operation in a manner maintaining a substantially planar upper surface and lower surface.
Claims29
A flip chip packaging assembly comprising:
- a flip chip device having an active circuit surface and an opposite inactive surface;
- a packaging substrate device having a connection surface electrically coupled to the active circuit surface of the flip chip device;
- a stiffener device positioned in heat conductive proximity to said flip chip device, and including a substantially thin and substantially rigid, plate-like member having a substantially uniform thickness defined by a substantially planar upper surface and an opposed substantially planar lower surface, said plate-like member further including a plurality of curved chamfer portions each defined by a respective chamfer edge commencing at a respective first peripheral side edge of the plate-like member and terminating at a respective second peripheral side edge, each said curved chamfer portion being formed and dimensioned to receptively engage and accommodate a respective clamping member therethrough for engaged alignment thereof;
- and
- a substantially thin, thermally conductive adhesive layer in conductive contact with and positioned between the stiffener device and the packaging substrate to bond said stiffener to the packaging substrate.
A stiffener device for use with a flip chip packaging assembly comprising:
- a generally rectangular, substantially rigid plate-like member having a substantially uniform thickness defined by a substantially planar upper surface and an opposed substantially planar lower surface, said plate-like member further including at each corner thereof a curved chamfer portion extending from the upper surface to the lower surface and defined by a chamfer edge commencing at one side edge forming the respective corner and terminating at an opposite side edge of the respective corner thereof, each said curved chamfer portion being formed and dimensioned to receptively engage and accommodate a respective mounting bolt extending substantially perpendicularly therethrough for alignment and supportive retainment of plate-like member.
Dependencies are inferred from the claim text.