Method for fabricating an integrated circuit module

A method of fabricating an integrated circuit module substrate on a base, comprising the steps of:

• applying an insulative base sheet over said base, said base sheet comprising a polymer film having an adhesive coating situated on the side of the polymer film opposite said base;
• placing a plurality of chips having contact pads face down on said base sheet;
• positioning a mold form around said chips;
• adding substrate molding material within said mold form;
• hardening said substrate molding material;
• separating said substrate molding material and said chips from said base sheet and base;
• applying a dielectric layer over said chips and said substrate molding material;
• forming a plurality of vias through said dielectric layer, some of said plurality of vias being aligned with predetermined ones of said contact pads;
• and
• providing a pattern of electrical conductors extending through selected ones of said plurality of vias in said dielectric layer to form an integrated circuit module.

A method of fabricating an integrated circuit module substrate on a base, comprising the steps of:

• applying an insulative base sheet over said base, said base sheet comprising an adhesive layer;
• placing a plurality of chips having contact pads face down on said base sheet;
• positioning a mold form around said chips;
• adding substrate molding material within said mold form;
• hardening said substrate molding material;
• separating said substrate molding material and said adhesive layer from said base;
• applying a dielectric layer over said adhesive layer;
• forming a plurality of vias through said dielectric layer, some of said plurality of vias being aligned with predetermined ones of said contact pads;
• and
• providing a pattern of electrical conductors extending through selected ones of said plurality of vias in said dielectric layer to form an integrated circuit module.

A method of fabricating an integrated circuit module substrate on a base, comprising the steps of:

• applying an insulative base sheet over said base, said base sheet comprising a polymer film having an adhesive coating situated on the side of the polymer film opposite said base;
• placing a chip having contact pads face down on said base sheet;
• positioning a mold form around said chip;
• adding substrate molding material within said mold form;
• hardening said substrate molding material;
• separating said base sheet from said base;
• forming a plurality of vias through said base sheet, some of said plurality of vias being aligned with predetermined ones of said contact pads;
• and
• providing a pattern of electrical conductors extending through selected ones of said plurality of vias in said base sheet.

A method of fabricating an integrated circuit module substrate, comprising the steps of:

• placing a plurality of chips having contact pads face down on a vacuum plate;
• applying a continuous vacuum to said vacuum plate;
• positioning a mold form around said chips;
• adding substrate molding material within said mold form;
• hardening said substrate molding material;
• separating said substrate molding material and said chips from said vacuum plate;
• applying a dielectric layer over said chips and said substrate molding material;
• forming a plurality of vias through said dielectric layer, some of said plurality of vias being aligned with predetermined ones of said contact pads;
• and
• providing a pattern of electrical conductors extending through selected ones of said plurality of vias in said dielectric layer to form an integrated circuit module.