H10W 40/70
Fillings or auxiliary members in containers or in encapsulations for thermal protection
Official title: Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
H10W40/70 (Fillings or auxiliary members in containers or in encapsulations for thermal protection) appears on 8,539 US grants and 10,828 published applications in this corpus.
Search patents in H10W- Granted patents
- 8,539
- Published applications
- 10,828
- Assignees
- 1,889
- Inventors
- 15,037
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 13 | 0 |
| 1977 | 19 | 0 |
| 1978 | 17 | 0 |
| 1979 | 7 | 0 |
| 1980 | 8 | 0 |
| 1981 | 13 | 0 |
| 1982 | 10 | 0 |
| 1983 | 10 | 0 |
| 1984 | 12 | 0 |
| 1985 | 15 | 0 |
| 1986 | 14 | 0 |
| 1987 | 25 | 0 |
| 1988 | 22 | 0 |
| 1989 | 32 | 0 |
| 1990 | 32 | 0 |
| 1991 | 43 | 0 |
| 1992 | 38 | 0 |
| 1993 | 48 | 0 |
| 1994 | 72 | 0 |
| 1995 | 86 | 0 |
| 1996 | 70 | 0 |
| 1997 | 87 | 0 |
| 1998 | 100 | 0 |
| 1999 | 120 | 0 |
| 2000 | 122 | 0 |
| 2001 | 149 | 59 |
| 2002 | 165 | 205 |
| 2003 | 177 | 267 |
| 2004 | 195 | 324 |
| 2005 | 235 | 366 |
| 2006 | 261 | 401 |
| 2007 | 229 | 469 |
| 2008 | 235 | 423 |
| 2009 | 215 | 439 |
| 2010 | 283 | 379 |
| 2011 | 267 | 338 |
| 2012 | 222 | 323 |
| 2013 | 224 | 378 |
| 2014 | 236 | 359 |
| 2015 | 288 | 393 |
| 2016 | 334 | 341 |
| 2017 | 275 | 345 |
| 2018 | 327 | 411 |
| 2019 | 362 | 485 |
| 2020 | 394 | 645 |
| 2021 | 417 | 622 |
| 2022 | 434 | 593 |
| 2023 | 425 | 593 |
| 2024 | 444 | 635 |
| 2025 | 448 | 557 |
| 2026 | 263 | 478 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Systems and methods for cooling high power devices6 Oct 2026US 12,756,154 B2Lawrence Livermore National Security, LLC
- Modular vapor chamber and connection of segments of modular vapor chamber6 Oct 2026US 12,757,354 B2Intel Corporation
- Inverted memory stack6 Oct 2026US 12,757,735 B2Advanced Micro Devices, Inc.
- Multiple plated via arrays of different wire heights on a same substrate6 Oct 2026US RE51,062 E1Adeia Semiconductor Technologies LLC
- Electronic devices and methods of manufacturing electronic devices29 Sep 2026US 12,751,321 B2Amkor Technology Singapore Holding Pte.Ltd.
- Lid Structure With Openings To Alleviate Leakage Of Thermal Interface Material Of A Chip Assembly8 Oct 2026US 2026/0314397 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Integrated circuit packages, devices using the same, and methods of forming the same8 Oct 2026US 2026/0314483 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Controlling an iron slurry in semiconductor assembly1 Oct 2026US 2026/0305343 A1Lenovo (Singapore) Pte. Ltd.
- System for Attaching a Thermal Interface Material to a Heat Sink24 Sep 2026US 2026/0292996 A1Dell Products L. P.
- Package structure and manufacturing method thereof24 Sep 2026US 2026/0293669 A1Taiwan Semiconductor Manufacturing Company.Ltd
Most cited
By later US patents
- Method for fabricating an integrated circuit module849US 5,353,498 AGeneral Electric Company · 1994
- Semiconductor device in a resin package housed in a frame having high thermal conductivity660US 5,625,222 AFujitsu Limited · 1997
- Semiconductor device having a pad array carrier package626US 5,216,278 AMotorola, Inc. · 1993
- Direct build-up layer on an encapsulated die package600US 6,271,469 B1Intel Corporation · 2001
- Thermal transfer coating486US 7,695,808 B23M Innovative Properties Company · 2010