H10W 40/77
Auxiliary members characterised by their shape
H10W40/77 (Auxiliary members characterised by their shape) appears on 3,991 US grants and 4,394 published applications in this corpus.
Search patents in H10W- Granted patents
- 3,991
- Published applications
- 4,394
- Assignees
- 899
- Inventors
- 7,220
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 8 | 0 |
| 1978 | 9 | 0 |
| 1979 | 5 | 0 |
| 1980 | 6 | 0 |
| 1981 | 8 | 0 |
| 1982 | 3 | 0 |
| 1983 | 2 | 0 |
| 1984 | 8 | 0 |
| 1985 | 8 | 0 |
| 1986 | 8 | 0 |
| 1987 | 16 | 0 |
| 1988 | 17 | 0 |
| 1989 | 21 | 0 |
| 1990 | 20 | 0 |
| 1991 | 33 | 0 |
| 1992 | 28 | 0 |
| 1993 | 33 | 0 |
| 1994 | 55 | 0 |
| 1995 | 61 | 0 |
| 1996 | 53 | 0 |
| 1997 | 65 | 0 |
| 1998 | 74 | 0 |
| 1999 | 79 | 0 |
| 2000 | 62 | 0 |
| 2001 | 86 | 34 |
| 2002 | 89 | 128 |
| 2003 | 107 | 132 |
| 2004 | 104 | 173 |
| 2005 | 122 | 145 |
| 2006 | 120 | 167 |
| 2007 | 99 | 167 |
| 2008 | 91 | 139 |
| 2009 | 87 | 147 |
| 2010 | 110 | 106 |
| 2011 | 115 | 109 |
| 2012 | 93 | 128 |
| 2013 | 99 | 151 |
| 2014 | 119 | 146 |
| 2015 | 135 | 192 |
| 2016 | 153 | 132 |
| 2017 | 120 | 124 |
| 2018 | 119 | 142 |
| 2019 | 139 | 171 |
| 2020 | 128 | 249 |
| 2021 | 187 | 256 |
| 2022 | 189 | 283 |
| 2023 | 179 | 258 |
| 2024 | 197 | 287 |
| 2025 | 204 | 193 |
| 2026 | 117 | 235 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Electronic devices and methods of manufacturing electronic devices29 Sep 2026US 12,751,321 B2Amkor Technology Singapore Holding Pte.Ltd.
- Systems and methods for an interlocking feature on a power module22 Sep 2026US 12,745,368 B2BorgWarner US Technologies LLC
- Systems and methods for active discharge for inverter for electric vehicle22 Sep 2026US 12,745,369 B2BorgWarner US Technologies LLC
- Piezoelectric MEMS-based active cooling for heat dissipation in compute devices22 Sep 2026US 12,745,638 B2Frore Systems Inc.
- Apparatus and method to reduce the thermal resistance of semiconductor substrates22 Sep 2026US 12,745,639 B2Board of Trustees of the University of Arkansas
- Systems and methods for power module for inverter for electric vehicle10 Sep 2026US 2026/0271237 A1BorgWarner US Technologies LLC
- Circuit assembly with a circuit carrier and a semiconductor component10 Sep 2026US 2026/0271744 A1Siemens Aktiengesellschaft
- Improved bond wire reliability and process with high tehrmal performance in small outline package27 Aug 2026US 2026/0255958 A1
- Liquid and air combo cooling for multi-chip modules27 Aug 2026US 2026/0255963 A1Adeia Semiconductor Bonding Technologies Inc.
- Embedded liquid cooling27 Aug 2026US 2026/0255970 A1Adeia Semiconductor Bonding Technologies Inc.
Most cited
By later US patents
- Method for fabricating an integrated circuit module849US 5,353,498 AGeneral Electric Company · 1994
- Semiconductor device in a resin package housed in a frame having high thermal conductivity660US 5,625,222 AFujitsu Limited · 1997
- Semiconductor device having a pad array carrier package626US 5,216,278 AMotorola, Inc. · 1993
- Direct build-up layer on an encapsulated die package600US 6,271,469 B1Intel Corporation · 2001
- Semiconductor device and semiconductor device unit having ball-grid-array type package structure437US 5,726,493 AFujitsu Limited · 1998