Semiconductor device and semiconductor device unit having ball-grid-array type package structure

A semiconductor device, comprising:

• a semiconductor element;
• a base having a mounting surface and a connection surface opposite to each other, said semiconductor element being mounted on said mounting surface, a plurality of balls which function as external connection terminals being provided on said connecting surface;
• a sealing resin sealing said semiconductor element, said sealing resin being formed on said mounting surface of said base;
• an electrode member having a first end and a second end, said first end of said electrode member being electrically connected to said semiconductor element on said mounting surface of said base, said second end of said electrode member being electrically connected to an outer terminal, said first end of said electrode member being electrically connected to and structurally independent from at least one of said plurality of balls;
• and
• a second base having an electrode pattern formed thereon, said second base being buried in said sealing resin, said electrode member being electrically connected to said electrode pattern formed on said second base,
• wherein said electrode member is an electrically conductive metal pin and said pin passes through said sealing resin formed on said mounting surface of said base, and
• wherein said sealing resin formed on said mounting surface of said base has a hole formed therein and said second end of said electrode member is positioned in said hole.

A semiconductor device unit comprising a plurality of semiconductor devices arranged in a stacked formation,

• each of said semiconductor devices, comprising:
• a semiconductor element;
• a base having a mounting surface and a connection surface opposite to each other, said semiconductor element being mounted on said mounting surface, a plurality of balls which function as external connection terminals being provided on said connection surface;
• a sealing resin sealing said semiconductor element, said sealing resin being formed on said mounting surface of said base;
• and
• an electrode member having a first end and a second end, said first end of said electrode member being electrically connected to said semiconductor element on said mounting surface of said base, said second end of said electrode member being electrically connected to an outer terminal, said first end of said electrode member being electrically connected to and structurally independent from at least one of said plurality of balls,
• wherein said electrode member is an electrically conductive metal pin and said pin passes through said sealing resin formed on said mounting surface of said base.

A semiconductor device unit comprising two semiconductor devices arranged in a stacked formation,

• each of said two semiconductor devices, comprising:
• a semiconductor element;
• a base having a mounting surface and a connection surface opposite to each other, said semiconductor element being mounted on said mounting surface, a plurality of balls which function as external connection terminals being provided on said connection surface;
• a sealing resin sealing said semiconductor element, said sealing resin being formed on said mounting surface of said base;
• and
• an electrode member having a first end and a second end, said first end of said electrode member being electrically connected to said semiconductor element on said mounting surface of said base, said second end of said electrode member being electrically connected to an outer terminal, said first end of said electrode member being electrically connected to and structurally independent from at least one of said plurality of balls,
• wherein said sealing resin has a hole formed therein and said second end of said electrode member is positioned in said hole in one of said semiconductor devices,
• wherein said electrode member is an electrically conductive metal pin and said pin passes through said sealing resin formed on said mounting surface of said base.