Circuit assembly with a circuit carrier and a semiconductor component

A circuit assembly, comprising

• a circuit carrier embodied as a printed circuit board, said circuit carrier including a first contact pad and a second contact pad;
• a lead frame connected to the circuit carrier via electrically conducting connections;
• a semiconductor component disposed between the circuit carrier and the lead frame and embodied as a transistor which includes a control terminal connected to the first contact pad of the circuit carrier, a first load terminal connected to the second contact pad of the circuit carrier, and a second load terminal, with the control terminal and the first load terminal facing the circuit carrier and with the second load terminal facing the lead frame;
• a bonding material connecting the second load terminal of the semiconductor component to the lead frame;
• a cooling body disposed on a side of the lead frame which side faces away from the semiconductor component,
• an electrically insulating insulation element disposed between the lead frame and the cooling body;
• and
• a pressing unit designed to press the circuit carrier, the semiconductor component, the lead frame, the insulation element and the cooling body against one another.