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US 12,745,639 B2Granted
Apparatus and method to reduce the thermal resistance of semiconductor substrates
AssigneeBoard of Trustees of the University of Arkansas
InventorsAmirreza Ghadimi Avval, Samir El-Ghazaly, Gregory J. Salamo, Shui-Qing Yu
Life of this patent
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Abstract
A semiconductor heat sink made of a first material including a plurality of spaced-apart depressions and an area surrounding the depressions filled with one or more materials having a heat conductivity greater than the first material.
Claims12
A semiconductor comprising:
- a heat producing active layer having electric circuitry that produces heat;
- a substrate having a heat sink, said heat sink made of a first material, said heat sink including a plurality of spaced-apart depressions;
- an area surrounding said depressions wherein said depressions are filled with one or more materials having a heat conductivity greater than said first material;
- and a plurality of heat-conducting members located in said depressions towards said heat producing active layer until terminating in said heat producing active layer, said heat-conducting members extend out of said depressions.
1 more element
Dependencies are inferred from the claim text.