H10W 40/772
Bellows
Official title: {Bellows}
H10W40/772 (Bellows) appears on 70 US grants and 45 published applications in this corpus.
Search patents in H10W- Granted patents
- 70
- Published applications
- 45
- Assignees
- 40
- Inventors
- 179
- Latest grant
- 4 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1979 | 1 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 1 | 0 |
| 1985 | 2 | 0 |
| 1986 | 0 | 0 |
| 1987 | 4 | 0 |
| 1988 | 5 | 0 |
| 1989 | 7 | 0 |
| 1990 | 4 | 0 |
| 1991 | 3 | 0 |
| 1992 | 3 | 0 |
| 1993 | 2 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 1 | 0 |
| 1997 | 1 | 0 |
| 1998 | 1 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 1 | 0 |
| 2002 | 0 | 0 |
| 2003 | 0 | 1 |
| 2004 | 1 | 4 |
| 2005 | 1 | 2 |
| 2006 | 1 | 1 |
| 2007 | 0 | 2 |
| 2008 | 2 | 1 |
| 2009 | 1 | 0 |
| 2010 | 0 | 0 |
| 2011 | 0 | 1 |
| 2012 | 1 | 2 |
| 2013 | 1 | 2 |
| 2014 | 0 | 0 |
| 2015 | 0 | 0 |
| 2016 | 1 | 1 |
| 2017 | 1 | 1 |
| 2018 | 0 | 1 |
| 2019 | 3 | 4 |
| 2020 | 0 | 4 |
| 2021 | 6 | 5 |
| 2022 | 1 | 1 |
| 2023 | 6 | 2 |
| 2024 | 3 | 6 |
| 2025 | 4 | 1 |
| 2026 | 1 | 3 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Compliant cooling plates4 Aug 2026US 12,701,675 B2Thermotech Holdings LLC
- Bellows for immersion cooling7 Oct 2025US 12,439,557 B2MTS IP Holdings Ltd
- Bellows for immersion cooling20 May 2025US 12,309,972 B2MTS IP Holdings Ltd
- Heterogeneous integrated multi-chip cooler module13 May 2025US 12,300,577 B2International Business Machines Corporation
- Compliant thermal management devices, systems, and methods of fabrication thereof25 Mar 2025US 12,262,509 B2
- Multi-material cold plate27 Aug 2026US 2026/0255971 A1Mellanox Technologies, Ltd.
- Bellows for immersion cooling9 Jul 2026US 2026/0197974 A1MTS IP Holdings Ltd
- Cold plate with controlled deformation9 Apr 2026US 2026/0101470 A1NVIDIA Corporation
- Semiconductor Cooling Device, Power Conversion Device, and Method for Manufacturing Semiconductor Cooling Device18 Dec 2025US 2025/0385159 A1Hitachi Astemo, Ltd.
- Pressure relief valve and adsorbent chamber for two-phase immersion cooling systems and methods for using same5 Dec 2024US 2024/0404916 A1MTS IP Holdings Ltd
Most cited
By later US patents
- Cooling system for VLSI circuit chips160US 4,561,040 AIBM Corporation · 1985
- Semiconductor resin package structure123US 4,825,284 AHitachi, Ltd. · 1989
- Apparatus for cooling integrated circuit chips with forced coolant jet115US 4,750,086 AUnisys Corporation · 1988
- Gas encapsulated cooling module91US 4,138,692 AInternational Business Machines Corporation · 1979
- Cooling module for integrated circuit chips75US 4,644,385 AHitachi, Ltd. · 1987