Cooling module for integrated circuit chips
AssigneeHitachi, Ltd.
InventorsKeiichirou Nakanishi, Minoru Yamada, Akira Masaki, Kuninori Imai, Katuaki Chiba
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Abstract
This invention concerns a cooling module for integrated circuit chips, characterized in that it is provided with cooling members through which a coolant circulates, and which are connected directly, or via insulating plates, to a plurality of integrated circuit chips mounted on a wiring substrate, and pipes which introduce the coolant into the cooling members and which have a resiliency which is high enough to enable the pipes to expand and contract in the direction perpendicular to the wiring substrate.
Claims19
A cooling module for integrated circuit chips, comprising a plurality of integrated circuit chips mounted on a wiring substrate, a plurality of cooling members which are placed on each of said integrated circuit chips and which are provided with internal spaces through which a coolant circulates, first pipe means connected to each of said cooling members so as to introduce said coolant thereinto, second pipe means connected to each of said cooling members so as to withdraw coolant therefrom, wherein said first and second pipe means have resilient bellows expandable in a direction perpendicular to a surface of said wiring substrate so that said pipe means can expand and contract in the direction perpendicular to the surface of said wiring substrate, and a coolant channel connected to said first and second pipe means so as to introduce and withdraw said coolant thereinto and therefrom
A multi-chip module comprising a wiring substrate, a plurality of integrated circuit chips mounted on said wiring substrate, a plurality of cooling members which are placed on each of said integrated circuit chips and which are provided with internal spaces through which a coolant circulates, first pipe means connected to each of said cooling members so as to introduce said coolant thereinto, second pipe means connected to each of said cooling members so as to withdraw said coolant therefrom, said first and second pipe means having resilient bellows expandable in a direction perpendicular to a surface of said wiring substrate so that said pipe means can expand and contract in the direction perpendicular to said wiring substrate, and a casing which has a cap opposite said wiring substrate which is provided with a hollow space acting as a channel for the introduction of said coolant into said first and second pipe means and side walls, and which seals in said integrated circuit chips.
Dependencies are inferred from the claim text.