Bellows for immersion cooling

A method of cooling semiconductor dies in a tank of a two-phase immersion-cooling system, the method comprising:

• receiving heat from the semiconductor dies into a coolant liquid within the tank, the coolant liquid filling a portion of the tank below an air space that occupies a top region of the tank, wherein the air space comprises a first portion of a first volume that is normally closed and contains a gas when the two-phase immersion-cooling system is operating;
• receiving a first amount of the gas from the air space into a second volume enclosed by a container of a bellows assembly in response to an increase in pressure of the gas in the air space, wherein the second volume comprises a second portion of the first volume, the bellows assembly comprising:
• the container,
• a gas port mounted to the container and fluidically coupled to the air space, and
• an isolation valve fluidically coupled between the gas port and the air space;
• deforming a first wall of the container in a first direction to increase the second volume while receiving the first amount of the gas;
• closing the isolation valve to isolate the second volume from the air space to prevent a second amount of the gas from flowing into the air space from the second volume and forcing coolant-liquid vapor out of the tank and into an ambient environment around the tank;
• and
• releasing, with a pressure-release valve, a third amount of the gas from the second volume into the ambient environment when pressure of the gas in the container exceeds a threshold value, wherein the pressure-release valve is located within 10 cm of a top edge of the container such that the third amount of the gas released from the second volume contains a lower percentage of coolant-liquid vapor from the coolant liquid used in the two-phase immersion-cooling system than if the pressure-release valve were located at a lower elevation on the container.