Heterogeneous integrated multi-chip cooler module
AssigneeInternational Business Machines Corporation
InventorsTimothy J. Chainer, Todd Edward Takken, Joshua M. Rubin, Arvind Kumar
Life of this patent
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Abstract
An exemplary apparatus includes a substrate; a plurality of chips mounted onto the substrate; a plurality of cold plates corresponding to the plurality of chips; means for pressing each of the cold plates toward a corresponding one of the chips; means for delivering coolant flow to the cold plates; and means for adjusting the cooling power of the plurality of cold plates, responsive to at least one sensed parameter of the plurality of chips.
Claims20
An apparatus comprising:
- a fluid manifold that has a principal inlet, a principal outlet, an inlet chamber, an outlet chamber, and a chip-facing surface that has matching pluralities of subsidiary outlets and inlets, wherein the principal inlet and each subsidiary outlet fluidly connects to the inlet chamber and the principal outlet and each subsidiary inlet fluidly connects to the outlet chamber;
- a plurality of pairs of bellows that are respectively attached and fluidly connected to corresponding pairs of the subsidiary outlets and inlets;
- a plurality of cold plates that each are fluidly connected between one of the pairs of bellows;
- and
- at least one spring that is positioned between the outlet chamber and a cold plate from the plurality of cold plates.
A method for cooling a multi-chip module that comprises a plurality of chips of differing vertical heights and operating temperature specifications, the method comprising:
- assembling a plurality of cold plates to a manifold, wherein the assembling comprises connecting a first plurality of bellows between inlets of the cold plates and an inlet chamber of the manifold, connecting a second plurality of bellows between outlets of the cold plates and an outlet chamber of the manifold, and inserting springs between the cold plates and the manifold, wherein at least one spring is inserted between the outlet chamber and a cold plate;
- attaching the manifold and cold plates to the multi-chip module by a frame that holds the manifold with each cold plate pressed against a corresponding chip of the multi-chip module;
- and
- flowing a coolant through the manifold and the cold plates.
An apparatus that comprises:
- a substrate;
- a plurality of chips mounted onto the substrate;
- a plurality of cold plates corresponding to the plurality of chips;
- at least one spring for pressing each of the cold plates toward a corresponding one of the chips;
- a manifold for delivering coolant flow to the cold plates, the manifold comprising an inlet chamber and an outlet chamber that are both connected to the plurality of cold plates, wherein the at least one spring is positioned between the outlet chamber and a cold plate from the plurality of cold plates;
- and
- means for adjusting the cooling power of the plurality of cold plates, responsive to at least one sensed parameter of the plurality of chips.
Dependencies are inferred from the claim text.