Cooling system for VLSI circuit chips

A system cooling an integrated circuit chip comprising:

• (a) a heat-sink having one surface in intimate contact with a back surface of said integrated circit chip, the front surface thereof making contact with a carrier for said integrated circuit chip;
• (b) said heat-sink including a semiconductor plate having a plurality of spaced parallel grooves, which grooves extend along the surface opposite said one surface and said grooves not extending through said heat-sink, for conducting liquid coolant so as to remove heat from said integrated circuit chip;
• (c) a coolant distribution means having spaced passageways for interconnecting oppositely directed first and second flow paths for liquid coolant to spaced points on said grooves of said heat-sink, said coolant distribution means further including
• 1. an interconnection element;
• 2. a channel element, which has its upper surface contacting said interconnection element and its lower surface in intimate contact with the upper surface of said heat-sink;
• 3. said passageways being defined by spaced channels in said channel element interconnecting with corresponding ducts in said interconnection element, said ducts terminating in inlet and outlet ports at the upper surface of said interconnection element.