H10W 40/778
In encapsulations
Official title: {in encapsulations}
H10W40/778 (In encapsulations) appears on 2,935 US grants and 3,281 published applications in this corpus.
Search patents in H10W- Granted patents
- 2,935
- Published applications
- 3,281
- Assignees
- 638
- Inventors
- 5,084
- Latest grant
- 22 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 6 | 0 |
| 1978 | 6 | 0 |
| 1979 | 1 | 0 |
| 1980 | 1 | 0 |
| 1981 | 3 | 0 |
| 1982 | 2 | 0 |
| 1983 | 0 | 0 |
| 1984 | 1 | 0 |
| 1985 | 1 | 0 |
| 1986 | 2 | 0 |
| 1987 | 2 | 0 |
| 1988 | 2 | 0 |
| 1989 | 3 | 0 |
| 1990 | 6 | 0 |
| 1991 | 16 | 0 |
| 1992 | 12 | 0 |
| 1993 | 19 | 0 |
| 1994 | 32 | 0 |
| 1995 | 41 | 0 |
| 1996 | 40 | 0 |
| 1997 | 54 | 0 |
| 1998 | 57 | 0 |
| 1999 | 60 | 0 |
| 2000 | 42 | 0 |
| 2001 | 67 | 26 |
| 2002 | 64 | 101 |
| 2003 | 83 | 101 |
| 2004 | 71 | 122 |
| 2005 | 96 | 104 |
| 2006 | 87 | 108 |
| 2007 | 70 | 123 |
| 2008 | 60 | 87 |
| 2009 | 62 | 100 |
| 2010 | 75 | 71 |
| 2011 | 83 | 77 |
| 2012 | 67 | 89 |
| 2013 | 73 | 117 |
| 2014 | 91 | 118 |
| 2015 | 111 | 153 |
| 2016 | 128 | 108 |
| 2017 | 94 | 99 |
| 2018 | 94 | 114 |
| 2019 | 111 | 137 |
| 2020 | 104 | 187 |
| 2021 | 139 | 194 |
| 2022 | 152 | 236 |
| 2023 | 133 | 218 |
| 2024 | 155 | 237 |
| 2025 | 167 | 148 |
| 2026 | 89 | 106 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Systems and methods for an interlocking feature on a power module22 Sep 2026US 12,745,368 B2BorgWarner US Technologies LLC
- Systems and methods for active discharge for inverter for electric vehicle22 Sep 2026US 12,745,369 B2BorgWarner US Technologies LLC
- Thermal management architecture for three-dimensional heterogeneous integrated layers8 Sep 2026US 12,733,489 B2HRL Laboratories, LLC
- Semiconductor device25 Aug 2026US 12,721,163 B2Denso Corporation
- Semiconductor device having a plurality of circuit patterns on a resin insulating layer25 Aug 2026US 12,721,164 B2Mitsubishi Electric Corporation
- Systems and methods for power module for inverter for electric vehicle10 Sep 2026US 2026/0271237 A1BorgWarner US Technologies LLC
- Improved bond wire reliability and process with high tehrmal performance in small outline package27 Aug 2026US 2026/0255958 A1
- Packaged device, method for manufacturing, and lead frame27 Aug 2026US 2026/0255985 A1NXP USA, Inc.
- Power Semiconductor Device Package20 Aug 2026US 2026/0247994 A1Wolfspeed, Inc.
- Package lid structure and methods of testing the same13 Aug 2026US 2026/0239958 A1Taiwan Semiconductor Manufacturing Company.Ltd
Most cited
By later US patents
- Method for fabricating an integrated circuit module849US 5,353,498 AGeneral Electric Company · 1994
- Semiconductor device in a resin package housed in a frame having high thermal conductivity660US 5,625,222 AFujitsu Limited · 1997
- Semiconductor device having a pad array carrier package626US 5,216,278 AMotorola, Inc. · 1993
- Direct build-up layer on an encapsulated die package600US 6,271,469 B1Intel Corporation · 2001
- Semiconductor device and semiconductor device unit having ball-grid-array type package structure437US 5,726,493 AFujitsu Limited · 1998