Back to results
US 12,733,489 B2Granted
Thermal management architecture for three-dimensional heterogeneous integrated layers
AssigneeHRL Laboratories, LLC
InventorsChristopher Roper, Souheil Nadri, Christina M. Seeholzer, Adam Gross, John H. Martin
Life of this patent
Estimating the term…
Abstract
A three-dimensional heterogeneous integrated (3DHI) package includes: a plurality of electrically interconnected active layers stacked on each other and a cooling block at a lower end of the active layers. Each of the active layers includes a semiconductor element, and at least one of the active layers includes an embedded heat spreader. The cooling block has a plurality of cooling channels formed therein, and the cooling channels do not extend through any of the active layers.
Claims9
A radio frequency (RF) front end comprising:
- a plurality of electrically interconnected active layers stacked on each other;
- and
- an antenna on an upper surface of the active layers, the antenna comprising a plurality of antenna elements on an upper surface thereof to form a phased array antenna, the antenna elements being electrically connected to the active layers via coaxial RF feeds,
- wherein the antenna comprises a plurality of microchannels in a microchannel layer and a RF dielectric layer between the antenna elements and the microchannel layer, the coaxial RF feeds extending through the microchannel layer.
1 more element
Dependencies are inferred from the claim text.