Power Semiconductor Device Package
AssigneeWolfspeed, Inc.
InventorAfshin Dadvand
Life of this patent
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Abstract
A power semiconductor device package is provided. The power semiconductor device package includes a submount, a semiconductor die on a first side of the submount, one or more reinforcing structures spaced apart from the semiconductor die on the submount, and a housing (e.g., encapsulating material) formed around at least a portion of the submount. In some examples, the reinforcing structure may include a different coefficient of thermal expansion (CTE) relative to the submount and/or the housing. In some examples, the reinforcing structure may include a different modulus of elasticity relative to the submount and/or the housing.
Claims20
A power semiconductor device package, comprising:
- a submount comprising a first side and a second side opposite the first side;
- a semiconductor die on the first side of the submount;
- a reinforcing structure on the submount, the reinforcing structure spaced apart from the semiconductor die, the reinforcing structure comprising a different coefficient of thermal expansion (CTE) relative to the submount;
- and
- a housing comprising an encapsulating material formed around at least a portion of the submount.
A power semiconductor device package, comprising:
- a submount comprising a first side and a second side opposite the first side;
- a semiconductor die on the first side of the submount;
- a first reinforcing structure on the first side of the submount;
- a second reinforcing structure on the second side of the submount, the second reinforcing structure being different from the first reinforcing structure;
- and
- a housing comprising an encapsulating material formed around at least a portion of the submount.
A power semiconductor device package, comprising:
- a submount comprising a first side and a second side opposite the first side;
- a semiconductor die on the first side of the submount;
- a reinforcing structure embedded in the submount, the reinforcing structure comprising a different coefficient of thermal expansion (CTE) relative to the submount;
- and
- a housing comprising an encapsulating material formed around at least a portion of the submount.
Dependencies are inferred from the claim text.