Semiconductor device

A semiconductor module comprising:

• a cooler;
• and
• a semiconductor device arranged adjacent to the cooler in a predetermined direction, wherein the semiconductor device includes:
• a semiconductor element having main electrodes on opposite faces opposite in the predetermined direction;
• a substrate having an insulating base member containing resin, a front-face metal body disposed on a front face of the insulating base member and a back-face metal body disposed on a back face of the insulating base member, the front-face metal body being electrically connected to at least one of the main electrodes of the semiconductor element;
• and
• a sealing body containing resin and sealing at least a part of the substrate and the semiconductor element,
• wherein the back-face metal body is exposed from the sealing body so that the back-face metal body faces the cooler and is thermally connected to the cooler through a heat conductive member,
• wherein a glass transition point of the insulating base member is referred to as Tgi, a linear expansion coefficient of the insulating base member is referred to as αi, a glass transition point of the sealing body is referred to as Tgs, and a linear expansion coefficient of the sealing body is referred to as αs, and
• wherein the insulating base member and the sealing body satisfy a relationship of Tgs≥Tgi and a relationship of αi≥αs in a direction orthogonal to the predetermined direction.