US 6,271,469 B1 · Direct build-up layer on an encapsulated die package

Abstract

A microelectronic package including a microelectronic die having an active surface and at least one side. An encapsulation material is disposed adjacent the microelectronic die side(s), wherein the encapsulation material includes at least one surface substantially planar to the microelectronic die active surface. A first dielectric material layer may be disposed on at least a portion of the microelectronic die active surface and the encapsulation material surface. At least one conductive trace is then disposed on the first dielectric material layer. The conductive trace(s) is in electrical contact with the microelectronic die active surface. At least one conductive trace extends vertically adjacent the microelectronic die active surface and vertically adjacent the encapsulation material surface.

Claims21

Dependent claims

A microelectronic package, comprising:

a microelectronic die having an active surface and at least one side;
encapsulation material adjacent said at least one microelectronic die side, wherein said encapsulation material includes at least one surface substantially planar to said microelectronic die active surface;
a first dielectric material layer disposed on at least a portion of said microelectronic die active surface and said encapsulation material surface;
and
at least one conductive trace disposed on said first dielectric material layer and in electrical contact with said microelectronic die active surface, wherein said at least one conductive trace extends vertically adjacent said microelectronic die active surface and vertically adjacent said encapsulation material surface.

2 more elements

Dependencies are inferred from the claim text.

Direct build-up layer on an encapsulated die package

Life of this patent

Direct build-up layer on an encapsulated die package

Life of this patent

Abstract

Claims21