Packaged device, method for manufacturing, and lead frame

A method for manufacturing a packaged device comprising a substrate, a die, and a lead frame;

• wherein the method comprises:
• mounting the die to the substrate, with a lower surface of the die facing an upper surface of the substrate;
• arranging a die flag of the lead frame over an upper surface of the die;
• arranging a plurality of leads of the lead frame to be around a periphery of the substrate, wherein each of the plurality of leads comprises an outer portion which has a lower surface and an upper surface opposite the lower surface, and wherein arranging the plurality of leads such that lower surfaces of the outer portions of the plurality of leads are coplanar with and separated from a lower surface of the substrate, wherein the plurality of leads comprise a first lead connected to the die flag, and a second lead separated from the die flag.

A lead frame comprising:

• a die flag comprising a cover portion having a lower surface and an upper surface opposite the lower surface;
• a plurality of leads arranged around, and spaced apart from, the die flag, each of the plurality of leads comprising an outer portion having a lower surface and an upper surface opposite the lower surface, the plurality of leads comprising:
• a first lead connected to the die flag and a connector bar;
• and
• a second lead connected to the connector bar, and separated from the die flag.