H10W 40/774
Pistons
Official title: {Pistons, e.g. spring-loaded members}
H10W40/774 (Pistons) appears on 181 US grants and 123 published applications in this corpus.
Search patents in H10W- Granted patents
- 181
- Published applications
- 123
- Assignees
- 80
- Inventors
- 448
- Latest grant
- 24 Feb 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 0 | 0 |
| 1978 | 1 | 0 |
| 1979 | 3 | 0 |
| 1980 | 4 | 0 |
| 1981 | 4 | 0 |
| 1982 | 0 | 0 |
| 1983 | 1 | 0 |
| 1984 | 3 | 0 |
| 1985 | 3 | 0 |
| 1986 | 2 | 0 |
| 1987 | 3 | 0 |
| 1988 | 5 | 0 |
| 1989 | 2 | 0 |
| 1990 | 5 | 0 |
| 1991 | 6 | 0 |
| 1992 | 9 | 0 |
| 1993 | 7 | 0 |
| 1994 | 7 | 0 |
| 1995 | 6 | 0 |
| 1996 | 4 | 0 |
| 1997 | 3 | 0 |
| 1998 | 4 | 0 |
| 1999 | 3 | 0 |
| 2000 | 1 | 0 |
| 2001 | 2 | 0 |
| 2002 | 3 | 4 |
| 2003 | 3 | 1 |
| 2004 | 6 | 8 |
| 2005 | 4 | 7 |
| 2006 | 5 | 7 |
| 2007 | 4 | 8 |
| 2008 | 3 | 7 |
| 2009 | 7 | 3 |
| 2010 | 5 | 4 |
| 2011 | 2 | 2 |
| 2012 | 0 | 10 |
| 2013 | 5 | 5 |
| 2014 | 4 | 7 |
| 2015 | 4 | 10 |
| 2016 | 4 | 6 |
| 2017 | 4 | 4 |
| 2018 | 3 | 0 |
| 2019 | 3 | 4 |
| 2020 | 4 | 8 |
| 2021 | 8 | 3 |
| 2022 | 2 | 7 |
| 2023 | 2 | 1 |
| 2024 | 3 | 4 |
| 2025 | 2 | 2 |
| 2026 | 2 | 1 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Heat spreader apparatus with magnetic attachments on printed wiring board assemblies, related methods and electronic systems24 Feb 2026US 12,564,051 B2Micron Technology, Inc.
- Cooling device3 Feb 2026US 12,543,294 B2Erwin Quarder Systemtechnik GmbH
- Chip module and electronic device16 Dec 2025US 12,500,136 B2Huawei Technologies Co., Ltd.
- Disc cell assembly clamp25 Nov 2025US 12,482,722 B2Advanced Energy Industries, Inc.
- Arrangement made up of cooling device and cooling article15 Oct 2024US 12,120,857 B2Erwin Quarder Systemtechnik GmbH
- Flexible diaphragm vapour chamber heat sink assembly30 Jul 2026US 2026/0223278 A1Ciena Corporation
- Chiplet integration structure for thermal management31 Jul 2025US 2025/0246499 A1International Business Machines Corporation
- Thermo-mechanical device for computing system29 May 2025US 2025/0174520 A1Xilinx, Inc.
- Disc cell assembly clamp30 May 2024US 2024/0179872 A1Advanced Energy Industries, Inc.
- Cooling device11 Apr 2024US 2024/0121915 A1Erwin Quarder Systemtechnik GmbH
Most cited
By later US patents
- High density multi-chip interconnection and cooling package154US 4,748,495 ADypax Systems Corporation · 1988
- Gas encapsulated cooling module150US 3,993,123 AInternational Business Machines Corporation · 1976
- Integral cooling system for electric components143US 5,309,319 AInternational Business Machines Corporation · 1994
- Connecting structure of electronic part and electronic device using the structure134US 5,086,337 AHitachi, Ltd. · 1992
- Impingment cooled compliant heat sink129US 5,168,348 AInternational Business Machines Corporation · 1992