Gas encapsulated cooling module
AssigneeInternational Business Machines Corporation
InventorsRichard C. Chu, Omkarnath R. Gupta, Un-Pah Hwang, Robert E. Simons
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AssigneeInternational Business Machines Corporation
InventorsRichard C. Chu, Omkarnath R. Gupta, Un-Pah Hwang, Robert E. Simons
Estimating the term…
A gas encapsulated cooling unit is provided for one or more heat generating components mounted on a substrate. A heat conductive cap is sealed to the substrate enclosing the heat generating components. The wall of the cap opposite the substrate contains elongated openings therein extending towards the heat generating components and on the same centers with respect thereto. A resilient member is located in the cap in communion with the inner end of the openings. A thermal conductive element is located in each of the openings forming a small peripheral gap between each opening wall and the associated thermal conductive element. The resilient member urges the thermal conductive elements into pressure contact with the heat generating components. A thermal conductive inert gas is located within the cap filling the peripheral gaps and the interfaces between the heat generating elements and the thermal conductive elements. The heat is removed from the cap by external heat removal means.
A gas encapsulated cooling module for heat generating elements comprising:
Dependencies are inferred from the claim text.