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AssigneeXilinx, Inc.
InventorsGamal REFAI-AHMED, Edward C. PRIEST, Chi-Yi CHAO, Suresh RAMALINGAM, Md Malekkul ISLAM
Estimating the term…
Disclosed herein are thermal management devices and electronic devices that utilized a plurality of plunger assemblies to route heat efficiently from chip packages. In some examples, the thermal management devices may also be used in electronic devices to route heat efficiently from power delivery layer residing below chip packages. In one example, a thermal management device is provided that includes a plurality of plunger assemblies retained to a metal plate. Each plunger assembly includes a metal body extending normally through an aperture formed between first and second sides of the plate and a spring biasing a distal end of the metal body away from the second side of the plate.
A thermal management device comprising:
An electronic device comprising:
A method for cooling an electronic device, the method comprising:
Dependencies are inferred from the claim text.