Connecting structure of electronic part and electronic device using the structure

A connecting structure for an electronic part, comprising:

• conductor means for electrically connecting said electronic part;
• a substrate having an electrical conductor to be electrically connected to said conductor means of said electronic part;
• a thin film lead member formed on said substrate into a planar shape of a two dimensional specified line being directly connected at only one part to said substrate sufficiently to provide spring movement, and having a width greater than a thickness of said lead member,
• another part of said lead member being indirectly connected to said conductor means, thereby connecting said conductor means to said electrical conductor at positions spaced along said specified line such that said electronic part and said substrate are mutually deformable relative to one another in any of a horizontal and vertical direction.

A connecting structure for an electronic part, comprising:

• conductor means for electrically connecting said electronic part;
• a substrate having an electrical conductor to be electrically connected to said conductor means of said electronic part;
• and
• a deposited thin film lead member deposited on said substrate into a planar shape of a specified line and being directly deposited connected at only one part to said substrate sufficiently to provide substantial three dimensional spring movement between the one part and another part, and
• another part of said deposited thin lead member being connected to said conductor means, thereby connecting said conductor means to said electrical conductor at positions spaced apart along said specified line such that said electronic part and said substrate are mutually deformable relative to one another in any of a horizontal and vertical direction.