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US 5,309,319 AGranted
Integral cooling system for electric components
AssigneeInternational Business Machines Corporation
InventorGaetano P. Messina
Life of this patent
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AssigneeInternational Business Machines Corporation
InventorGaetano P. Messina
Estimating the term…
An integral cooling system for cooling a plurality of electronic components, including: a cooling fluid manifold for mounting over the plurality of electronic components; a main fluid inflow duct within the manifold for supplying pumped cooling fluid; a main fluid outflow duct within the manifold for removing pumped cooling fluid; for each respective electronic component of the plurality of electronic components: a component cooling chamber within the manifold, for application of cooling fluid to an area immediately adjacent the electronic component; a fluid supplying duct within the manifold to supply cooling fluid from the main fluid inflow duct to the chamber; and, a fluid removing duct within the manifold to remove cooling fluid from the chamber to the main fluid outflow duct. In preferred embodiments, there is a thermally-conductive slug or piston disposed between the respective electronic component and component cooling chamber to prevent direct application of a flow of the pumped cooling fluid to the respective electronic component, and to encourage uniform cooling across the respective electronic component.
An integral cooling system which cools a plurality of electronic components, said system comprising:
An integral cooling system which cools a plurality of electronic components, said system comprising:
Dependencies are inferred from the claim text.