H10W 40/73
For cooling by change of state
Official title: for cooling by change of state
H10W40/73 (For cooling by change of state) appears on 3,317 US grants and 4,910 published applications in this corpus.
Search patents in H10W- Granted patents
- 3,317
- Published applications
- 4,910
- Assignees
- 1,141
- Inventors
- 6,806
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 12 | 0 |
| 1977 | 11 | 0 |
| 1978 | 7 | 0 |
| 1979 | 1 | 0 |
| 1980 | 3 | 0 |
| 1981 | 4 | 0 |
| 1982 | 7 | 0 |
| 1983 | 6 | 0 |
| 1984 | 3 | 0 |
| 1985 | 4 | 0 |
| 1986 | 6 | 0 |
| 1987 | 9 | 0 |
| 1988 | 5 | 0 |
| 1989 | 10 | 0 |
| 1990 | 10 | 0 |
| 1991 | 8 | 0 |
| 1992 | 9 | 0 |
| 1993 | 15 | 0 |
| 1994 | 16 | 0 |
| 1995 | 23 | 0 |
| 1996 | 14 | 0 |
| 1997 | 17 | 0 |
| 1998 | 18 | 0 |
| 1999 | 35 | 0 |
| 2000 | 52 | 0 |
| 2001 | 51 | 24 |
| 2002 | 71 | 78 |
| 2003 | 67 | 113 |
| 2004 | 71 | 127 |
| 2005 | 100 | 186 |
| 2006 | 126 | 209 |
| 2007 | 102 | 275 |
| 2008 | 128 | 233 |
| 2009 | 115 | 255 |
| 2010 | 147 | 246 |
| 2011 | 126 | 202 |
| 2012 | 101 | 172 |
| 2013 | 96 | 179 |
| 2014 | 93 | 167 |
| 2015 | 105 | 131 |
| 2016 | 121 | 148 |
| 2017 | 99 | 167 |
| 2018 | 148 | 187 |
| 2019 | 161 | 209 |
| 2020 | 170 | 251 |
| 2021 | 159 | 208 |
| 2022 | 137 | 175 |
| 2023 | 125 | 212 |
| 2024 | 142 | 225 |
| 2025 | 161 | 260 |
| 2026 | 90 | 271 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Systems and methods for cooling high power devices6 Oct 2026US 12,756,154 B2Lawrence Livermore National Security, LLC
- Modular vapor chamber and connection of segments of modular vapor chamber6 Oct 2026US 12,757,354 B2Intel Corporation
- Inverted memory stack6 Oct 2026US 12,757,735 B2Advanced Micro Devices, Inc.
- Ultra-scaled transistor devices to enable cell size scaling15 Sep 2026US 12,740,115 B2Intel Corporation
- Semiconductor packaging15 Sep 2026US 12,740,414 B2Chung Ang University Industry Academic Cooperation Foundation
- Controlling an iron slurry in semiconductor assembly1 Oct 2026US 2026/0305343 A1Lenovo (Singapore) Pte. Ltd.
- Composite cooling disk for continuous transient cooling for semiconductor chip17 Sep 2026US 2026/0282909 A1Western Digital Technologies, Inc.
- Micro-electromechanical systems (mems) devices10 Sep 2026US 2026/0271724 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor device10 Sep 2026US 2026/0271725 A1Nexperia B. V.
- Three-dimensional integrated circuit10 Sep 2026US 2026/0271726 A1KV Innovations, LLC
Most cited
By later US patents
- Thermal transfer coating486US 7,695,808 B23M Innovative Properties Company · 2010
- Stack module249US 5,883,426 ANEC Corporation · 1999
- Heat exchange apparatus227US 6,019,165 A2000
- Apparatus for cooling charge coupled device imaging systems202US 5,596,228 AOEC Medical Systems, Inc. · 1997
- Microcomponent assembly for efficient contacting of fluid191US 6,126,723 ABattelle Memorial Institute · 2000