H10W 40/735
By melting or evaporation of solids
Official title: {by melting or evaporation of solids}
H10W40/735 (By melting or evaporation of solids) appears on 334 US grants and 404 published applications in this corpus.
Search patents in H10W- Granted patents
- 334
- Published applications
- 404
- Assignees
- 194
- Inventors
- 800
- Latest grant
- 25 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1982 | 1 | 0 |
| 1983 | 0 | 0 |
| 1984 | 1 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 3 | 0 |
| 1992 | 1 | 0 |
| 1993 | 1 | 0 |
| 1994 | 1 | 0 |
| 1995 | 2 | 0 |
| 1996 | 0 | 0 |
| 1997 | 1 | 0 |
| 1998 | 1 | 0 |
| 1999 | 3 | 0 |
| 2000 | 2 | 0 |
| 2001 | 9 | 1 |
| 2002 | 6 | 11 |
| 2003 | 11 | 22 |
| 2004 | 9 | 21 |
| 2005 | 17 | 17 |
| 2006 | 15 | 9 |
| 2007 | 6 | 14 |
| 2008 | 4 | 5 |
| 2009 | 6 | 10 |
| 2010 | 4 | 11 |
| 2011 | 7 | 8 |
| 2012 | 3 | 10 |
| 2013 | 5 | 11 |
| 2014 | 9 | 22 |
| 2015 | 18 | 19 |
| 2016 | 20 | 25 |
| 2017 | 16 | 21 |
| 2018 | 25 | 21 |
| 2019 | 27 | 19 |
| 2020 | 17 | 32 |
| 2021 | 21 | 20 |
| 2022 | 13 | 14 |
| 2023 | 18 | 19 |
| 2024 | 13 | 22 |
| 2025 | 11 | 12 |
| 2026 | 7 | 8 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Liquid metal based thermal interface material25 Aug 2026US 12,720,712 B2Lenovo (Singapore) Pte. Ltd.
- Power semiconductor module arrangement comprising heat-conducting layer and heat sink and method for producing the same18 Aug 2026US 12,713,920 B2Infineon Technologies Austria AG
- Heatsink for ring type integrated circuits14 Jul 2026US 12,685,167 B2Cisco Technology, Inc.
- Leak-proof heat dissipation structure of high thermal conductivity materials14 Jul 2026US 12,685,168 B2Cchuan Co., Ltd.
- Semiconductor module having a plurality of heat sink plates17 Mar 2026US 12,581,951 B2Denso Corporation
- Fin structure and solid-liquid phase change material27 Aug 2026US 2026/0255968 A1QUALCOMM Incorporated
- Housing for an electronic component, assembly having a housing, and method for producing a housing20 Aug 2026US 2026/0247572 A1Lisa Draexlmaier GmbH
- Fabrication method of liquid alloy thermal paste13 Aug 2026US 2026/0234458 A1Cooler Materials Technology Inc.
- Transient thermal management of integrated hybrid heat dissipation system6 Aug 2026US 2026/0231763 A1
- Heat dissipation interface member, preparation method therefor, and semiconductor package comprising same6 Aug 2026US 2026/0231764 A1Amogreentech Co., Ltd.
Most cited
By later US patents
- Apparatus for dissipating heat from a circuit board having a multilevel surface144US 6,212,074 B1Sun Microsystems, Inc. · 2001
- Vapor escape microchannel heat exchanger132US 6,994,151 B2Cooligy, Inc. · 2006
- Cooling system and method employing auxiliary thermal capacitor unit for facilitating continuous operation of an electronics rack129US 7,086,247 B2International Business Machines Corporation · 2006
- Thermally conductive polytrafluoroethylene article120US 5,945,217 AGore Enterprise Holdings, Inc. · 1999
- Microencapsulated phase change material slurry heat sinks102US 5,007,478 AUniversity of Miami · 1991