Heatsink for ring type integrated circuits
AssigneeCisco Technology, Inc.
InventorsYongguo Chen, Kai Cao, Hua Yang, Vic Hong Chia, Paul Ton
Life of this patent
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Abstract
The systems and cold plate pedestal and assembly described decrease mechanical stresses in integrated circuits, while also providing efficient thermal coupling between heat producing components and a cold plate. A cold plate assembly includes a cold plate with a pedestal portion a groove formed in a surface of the pedestal portion. The cold plate assembly also includes a thermal pad layer formed in the groove and a phase change material (PCM) layer formed on the surface of the pedestal portion and a surface of the thermal pad layer formed in the groove.
Claims20
A cold plate assembly comprising:
- a cold plate comprising a pedestal portion on a first side of the cold plate;
- a groove formed in a surface of the pedestal portion comprising a first rounded groove edge;
- a thermal pad layer formed in the groove, wherein the thermal pad layer in the groove is disposed between a phase change material (PCM) layer and the surface of the pedestal portion forming the groove;
- and
- the PCM layer formed on the surface of the pedestal portion and a surface of the thermal pad layer formed in the groove.
A system for cooling a heat source, comprising:
- cold plate assembly thermally connected to the heat source, the cold plate assembly comprising:
- a cold plate comprising a pedestal portion on a first side of the cold plate;
- a groove formed in a surface of the pedestal portion comprising a first rounded groove edge;
- a thermal pad layer formed in the groove, wherein the thermal pad layer in the groove is disposed between a phase change material (PCM) layer and the surface of the pedestal portion forming the groove;
- and
- the PCM layer formed on the surface of the pedestal portion and a surface of the thermal pad layer formed in the groove.
A system for cooling a heat source, comprising:
- a heatsink disposed remotely from the heat source;
- a cold plate assembly connected to the heatsink via a plurality of thermal pipes,
- wherein the cold plate assembly comprises:
- a cold plate comprising a pedestal portion on a first side of the cold plate;
- a groove formed in a surface of the pedestal portion comprising a first rounded groove edge;
- a thermal pad layer formed in the groove, wherein the thermal pad layer in the groove is disposed between a phase change material (PCM) layer and the surface of the pedestal portion forming the groove;
- and
- the PCM layer formed on the surface of the pedestal portion and a surface of the thermal pad layer formed in the groove.
Dependencies are inferred from the claim text.