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US 12,581,951 B2Granted
Semiconductor module having a plurality of heat sink plates
AssigneesDenso Corporation, Toyota Jidosha Kabushiki Kaisha, MIRISE Technologies Corporation
InventorShohei Nagai
Life of this patent
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Abstract
A semiconductor module includes a substrate, a semiconductor element and a heat sink plate. The substrate is included in a circuit board. The semiconductor element is disposed at the heat sink plate inside the substrate. A fluid is sealed inside the heat sink plate.
Claims13
A semiconductor module comprising:
- a substrate included in a circuit board;
- a plurality of semiconductor elements configured to be disposed inside the substrate;
- a plurality of heat sink plates disposed inside the substrate;
- and
- a plurality of terminals, wherein
- each terminal of the plurality of terminals is configured to be exposed to a surface of the substrate,
- each terminal of the plurality of terminals is configured to be electrically connected to a corresponding semiconductor element of the plurality of semiconductor elements inside the substrate,
- a fluid is sealed inside the plurality of heat sink plates,
- the plurality of semiconductor elements is in direct contact with the plurality of heat sink plates,
- at least one terminal of the plurality of terminals is electrically connected to at least one semiconductor element of the plurality of semiconductor elements via at least one heat sink plate of the plurality of heat sink plates,
- a plurality of spaces are located within an interior of each heat sink plate of the plurality of heat sink plates,
- each of the plurality of spaces extends in a longitudinal direction of the plurality of heat sink plates,
- the fluid is sealed within each of the plurality of spaces, and
- the plurality of spaces are isolated from each other.
11 more elements
A semiconductor module comprising:
- a substrate included in a circuit board;
- a semiconductor element configured to be disposed inside the substrate;
- and
- a heat sink plate disposed inside the substrate, wherein
- a fluid is sealed inside the heat sink plate,
- the semiconductor element is in direct contact with the heat sink plate,
- a space is located within an interior of the heat sink plate,
- the fluid is sealed within the space, and
- an inner wall of the space has a plurality of protruding portions extending radially from a center of the heat sink plate.
6 more elements
A semiconductor module comprising:
- a substrate included in a circuit board;
- a semiconductor element configured to be disposed inside the substrate;
- and
- a heat sink plate disposed inside the substrate, wherein
- a plurality of spaces are located within an interior of the heat sink plate,
- each of the plurality of spaces extends in a longitudinal direction of the heat sink plate,
- a fluid is sealed within each of the plurality of spaces, and
- the plurality of spaces are isolated from each other.
5 more elements
Dependencies are inferred from the claim text.