Leak-proof heat dissipation structure of high thermal conductivity materials

An improved leak-proof heat dissipation structure of high thermal conductivity materials used to dissipate heat from a heat source on a chip body, said improved leak-proof heat dissipation structure of high thermal conductivity materials comprising:

• an insulating film layer placed on a top of said heat source, said insulating film layer comprising a film opening located at a central area thereof;
• a high thermal conductivity thermal interface material layer disposed close to said heat source and located above said chip body, said high thermal conductivity thermal interface material layer being provided in said film opening;
• a first flexible material composite layer placed on a top of said insulating film layer, said first flexible material composite layer comprising a first opening located at a central area thereof, said first flexible material composite layer being sticky on two opposite sides thereof;
• a second flexible material composite layer provided below said insulating film layer, said second flexible material composite layer comprising a second opening located at a central area thereof, said second flexible material composite layer being sticky on two opposite sides thereof;
• and
• a radiator disposed on a top of said first flexible material composite layer and bonded to said first flexible material composite layer, said radiator comprising a boss located at a bottom thereof and a plurality of storage grooves located on said boss, said boss having a thickness of 0.1~10 mm, said storage grooves having a depth of 0.01~1 mm.