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US 2026/0255968 A1Published application
Fin structure and solid-liquid phase change material
AssigneeQUALCOMM Incorporated
InventorsLe GAO, Youmin YU, Nader NIKFAR
Life of this patent
Estimating the term…
Abstract
Disclosed are semiconductor packages. In one or more aspects, a thermally conductive lid is provided to transfer heat away from a die during operations. The lid contains solid-liquid phase change material (SLPCM). The SLPCM changes phase from solid to liquid while maintaining constant temperature. Thus, the lid with the SLPCM is more effective as a heat sink than the conventional solid lids.
Claims20
A semiconductor package, comprising:
- a die on a substrate;
- a thermal interface material (TIM) on an upper surface of the die;
- and
- a lid on the TIM, the lid comprising:
- a chassis and a cover on the chassis, wherein the chassis and the cover define an internal volume of the lid;
- and
- a solid-liquid phase change material (SLPCM) within the internal volume of the lid.
4 more elements
A method of fabricating a semiconductor package, the method comprising:
- providing a die on a substrate;
- forming a thermal interface material (TIM) on an upper surface of the die;
- and
- providing a lid on the TIM, the lid comprising:
- a chassis and a cover on the chassis, wherein the chassis and the cover define an internal volume of the lid;
- and
- a solid-liquid phase change material (SLPCM) within the internal volume of the lid.
4 more elements
Dependencies are inferred from the claim text.