Microencapsulated phase change material slurry heat sinks
AssigneeUniversity of Miami
InventorSubrata Sengupta
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Abstract
A slurry of micro-encapsulated phase change materials is provided in accordance with the present invention as a heat sink for, for example, the thermal management of electronic components. The slurry of micro-encapsulated phase change material may be provided within an open container and the electronic component immersed therein. In the alternative, the slurry of micro-encapsulated phase change material can be provided within a container of either flexible bag-like design or a relatively rigid preformed structure to be mounted adjacent the article to be thermally controlled.
Claims20
A heat sink device comprising:
- a sealed container;
- and
- a slurry of a microencapsulated phase change material and a fluid sealed within said container, said slurry being free flowing within said container.
A method of maintaining the temperature of an electronic component comprising:
- providing a slurry of a liquid and microencapsulated phase change material;
- placing said slurry in an open container;
- and
- immersing the electronic component in said slurry within said container.
A method of maintaining the temperature of an electronic component comprising:
- providing a slurry of a liquid and microencapsulated phase change material;
- providing a container;
- disposing said slurry in said container;
- sealing said container;
- and
- placing said sealed container in contact with an electronic component.
Dependencies are inferred from the claim text.