Semiconductor device
AssigneeNexperia B.V.
InventorsWei Gong, Pulong Cao, Hui Liu
Life of this patent
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Abstract
A semiconductor device is proposed, including a substrate, at least a first semiconductor die having a first die surface and a second die surface opposite to the first die surface, the at least one semiconductor die is mounted with the first die surface on the substrate, and at least one heat transfer component including a spatial configuration composed of a first component face and a second component face spaced apart from each other defining a spatial enclosure comprising a heat transfer medium, and the at least one heat transfer component is in heat exchanging contact with the second die surface and the substrate.
Claims15
A semiconductor device comprising:
- a substrate;
- at least one first semiconductor die having a first die surface and a second die surface opposite to the first die surface, wherein the at least one semiconductor die is mounted with the first die surface on the substrate;
- at least one heat transfer component comprising a spatial configuration composed of a first component face and a second component face spaced apart from each other defining a spatial enclosure comprising a heat transfer medium, and wherein the at least one heat transfer component is in heat exchanging contact with the second die surface and the substrate.
Dependencies are inferred from the claim text.