Three-dimensional integrated circuit
AssigneeKV Innovations, LLC
InventorsKambiz Vafai, Sainan Lu
Life of this patent
Estimating the term…
Abstract
A three-dimensional integrated circuit device can include a group of die, a device layer and a thermal interface material formed above the substrate. A heat spreader can be located above the die, the device layer and the thermal interface material. The heat spreader can include a heat pipe comprising a rectangular-shaped heat pipe or disk-shaped heat pipe. A heat sink can be located above the heat spreader. The heat sink can include the heat pipe comprising the rectangular-shaped heat pipe or the disk-shaped heat pipe.
Claims21
1-3. (canceled)
An integrated circuit device, comprising:
- a thermal interface material layer configured above or from a substrate;
- a plurality of die, a device layer and a micro-bump thermal interface material layer formed above thermal interface material layer;
- a heat spreader located above the plurality of die, the device layer and the thermal interface material, the heat spreader comprising a flat-shaped heat pipe selected from a rectangular-shaped heat pipe and a disk-shaped heat pipe, and
- a heat sink comprising at least one of the rectangular-shaped heat pipe or the disk-shaped heat pipe, wherein the flat-shaped heat pipe is configured as the heat spreader, the heat sink, or both the heat spreader and the heat sink to improve a thermal performance of the integrated circuit device.
An integrated circuit apparatus comprising:
- one or more semiconductor devices disposed within an integrated circuit package;
- a flat-shaped heat pipe thermally coupled to the one or more semiconductor devices, wherein the flat-shaped heat pipe comprises a rectangular-shaped heat pipe or a disk-shaped heat pipe, and wherein the flat-shaped heat pipe is configured to transfer heat away from the one or more semiconductor devices to reduce hotspot temperature within the integrated circuit package.
An integrated circuit device comprising:
- a stacked integrated circuit structure;
- and
- a flat-shaped heat pipe positioned between the stacked integrated circuit structure and a heat sink and configured as a heat spreader.
Dependencies are inferred from the claim text.