Micro-electromechanical systems (mems) devices
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorYu-Hsun Li
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Abstract
Micro-electromechanical systems (MEMS) devices that include a carrier wafer are disclosed, along with their use for cooling heat-generating devices using dielectric liquids. The MEMS device includes an actuator bonded to a carrier wafer. The carrier wafer includes a plurality of holes extending through a substrate. The carrier wafer is adhered to a surface of the heat-generating device, and the resulting package is placed in the dielectric liquid. The actuator vibrates and increases the rate of liquid flow past the heat-generating device, improving the cooling effect.
Claims20
A method for cooling a heat-generating device, comprising:
- receiving a cooling device comprising an actuator and a carrier wafer;
- wherein the carrier wafer comprises one or more holes that extend through a substrate from a first side to a second side of the substrate;
- and
- wherein the first side of the carrier wafer is bonded to the actuator;
- adhering the second side of the carrier wafer substrate to a surface of the heat-generating device to form a package;
- and
- placing the package in a cooling fluid;
- wherein the cooling fluid can flow between the second side of the carrier wafer substrate and the surface of the heat-generating device.
The method of claim 9, wherein the at least one cavity has a depth of about 10 μm or greater, or has a length of about 20 μm or greater.
A cooling device comprising an actuator bonded to a substrate, wherein the substrate comprises;
- an intermediate region between a perimeter region and a central region of the substrate, wherein the intermediate region has a thickness which is less than a thickness of the perimeter region;
- at least one cavity in the intermediate region in a first side of the substrate;
- and
- one or more holes in the at least one cavity that extend through the substrate to a second side of the substrate.
A method for making a carrier wafer, comprising:
- forming a first mask upon a first side of a substrate, the first mask exposing an intermediate region between a perimeter region and a central region of the substrate;
- forming at least one cavity in the intermediate region in the substrate;
- forming a second mask upon the first side of the substrate, the second mask exposing one or more hole regions in the intermediate region;
- etching through the one or more hole regions to form one or more holes that extend through the substrate to a second side of the substrate and obtain the carrier wafer.
Dependencies are inferred from the claim text.