H10W 40/30
Wherein the packaged device is completely immersed in a fluid other than
Official title: wherein the packaged device is completely immersed in a fluid other than air, e.g. immersed in a cryogenic fluid
H10W40/30 (Wherein the packaged device is completely immersed in a fluid other than) appears on 302 US grants and 447 published applications in this corpus.
Search patents in H10W- Granted patents
- 302
- Published applications
- 447
- Assignees
- 183
- Inventors
- 880
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 0 | 0 |
| 1978 | 3 | 0 |
| 1979 | 1 | 0 |
| 1980 | 0 | 0 |
| 1981 | 1 | 0 |
| 1982 | 0 | 0 |
| 1983 | 1 | 0 |
| 1984 | 1 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 1 | 0 |
| 1988 | 4 | 0 |
| 1989 | 5 | 0 |
| 1990 | 5 | 0 |
| 1991 | 5 | 0 |
| 1992 | 5 | 0 |
| 1993 | 5 | 0 |
| 1994 | 4 | 0 |
| 1995 | 3 | 0 |
| 1996 | 3 | 0 |
| 1997 | 2 | 0 |
| 1998 | 4 | 0 |
| 1999 | 3 | 0 |
| 2000 | 4 | 0 |
| 2001 | 5 | 1 |
| 2002 | 1 | 2 |
| 2003 | 4 | 5 |
| 2004 | 6 | 4 |
| 2005 | 2 | 2 |
| 2006 | 1 | 5 |
| 2007 | 6 | 5 |
| 2008 | 2 | 5 |
| 2009 | 2 | 2 |
| 2010 | 3 | 3 |
| 2011 | 0 | 3 |
| 2012 | 2 | 4 |
| 2013 | 2 | 4 |
| 2014 | 3 | 10 |
| 2015 | 7 | 5 |
| 2016 | 4 | 8 |
| 2017 | 11 | 25 |
| 2018 | 14 | 15 |
| 2019 | 19 | 19 |
| 2020 | 18 | 28 |
| 2021 | 16 | 20 |
| 2022 | 19 | 30 |
| 2023 | 15 | 47 |
| 2024 | 18 | 45 |
| 2025 | 36 | 29 |
| 2026 | 25 | 121 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Electronic components employing field ionization29 Sep 2026US 12,751,052 B2Psiquantum, Corp.
- Controlling an iron slurry in semiconductor assembly25 Aug 2026US 12,721,166 B2Lenovo (Singapore) Pte. Ltd.
- Composition18 Aug 2026US 12,709,703 B2Mexichem Fluor S.A. De C.V.
- Transistor-scale thermoelectric devices for refrigeration of integrated circuits11 Aug 2026US 12,707,971 B2Intel Corporation
- Immersion cooling system for integrated circuit14 Jul 2026US 12,684,734 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Immersion cooling system for integrated circuit1 Oct 2026US 2026/0304696 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Controlling an iron slurry in semiconductor assembly1 Oct 2026US 2026/0305343 A1Lenovo (Singapore) Pte. Ltd.
- Immersion cooling-compatible multimode optical module10 Sep 2026US 2026/0267095 A1Cisco Technology, Inc.
- Systems and methods for liquid cooling of a heat-generating semiconductor device10 Sep 2026US 2026/0271720 A1
- System and methods for multi-phase semiconductor package cooling13 Aug 2026US 2026/0239973 A1Samsung Electronics Co., Ltd.
Most cited
By later US patents
- Microchannel heat sink assembly166US 5,099,311 AThe United States of America as represented by the United States Department of Energy · 1992
- Gas encapsulated cooling module150US 3,993,123 AInternational Business Machines Corporation · 1976
- Convection transfer system120US 5,310,440 AInternational Business Machines Corporation · 1994
- Method and apparatus for immersion cooling or an electronic board92US 5,305,184 AIBM Corporation · 1994
- Gas encapsulated cooling module91US 4,138,692 AInternational Business Machines Corporation · 1979